6th International Conference and Exhibition on Device Packaging www.imaps.org/devicepackaging Radisson Fort McDowell Resort and Casino Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops March 9-11, 2010 Exhibition and Technology Showcase March 9-10, 2010 Professional Development Courses March 8, 2010 GBC Spring Conference March 7-8, 2010 In conjunction with the Global Business Council (GBC) Spring Conference, March 7-8 Courtesy of Rensselaer Polytechnic Institute Courtesy of US Army RDEDCOM AMRDEC General Chair: Phil Garrou Microelectronic Consultants of NC 3D Packaging Topical Workshop Flip Chip Technologies Topical Workshop Wafer Level Packaging Topical Workshop MEMS & Microsystems Topical Workshop Emerging Tech (LEDs & Passives) Topical Workshop Technical Co-Chair: James J.-Q. Lu Rensselaer Polytechnic Institute Technical Co-Chair: Linda Bal Freescale Semiconductor Technical Co-Chair: Ted Tessier FlipChip International Technical Co-Chair: Robert Dean Auburn University Technical Co-Chair: Frank Wall Philips Technical Co-Chair: Lee Smith Amkor Technology Technical Co-Chair: Lou Nicholls Amkor Technology Technical Co-Chair: Andrew Strandjord Pac Tech USA Technical Co-Chair: Tracy Hudson US Army Technical Co-Chair: Robert Heistand AVX

EARLY REGISTRATION CUT-OFF: FEBRUARY 19, 2010
HOTEL DEADLINE: FEBRUARY 4, 2010

On-line Registration | Hotel Reservations
Technical Program | Speaker Information | Professional Development Courses (PDCs)
Exhibition | Reserve Exhibits On-line | Floorplan | 2010 Exhibitors | 2009 Exhibitors
Global Business Council (GBC) Spring Conference

Conference Overview:

The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).

This year’s conference will feature technical sessions, four plenary speakers, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3D Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Packaging; Passive Integration and LED. Technical presentations in these 6 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these topical areas of microelectronics and offer an additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March 7-8, focusing on the business aspects of these technologies. There will be several networking receptions and gatherings throughout the week, including the opening reception, meals, and other social events.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Only a few booths remain. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

View the Technical Program | On-line Registration

Housing
Hotel Reservation Deadline - February 4, 2010

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300

Online Reservations: http://www.radisson.com/reservation/resEntrance.do?pacLink=Y&promoCode=IMAP10&hotelCode=AZMCDOWE Or use Promotional Code: IMAP10 from the hotel’s direct website: http://www.radisson.com/hotels/azmcdowe

**Working on special reservation process for government rate.

Speaker Dates/Information:

• Hotel Reservation Deadline: February 4, 2010
• Extended Abstract or Abstract Book Materials due: February 12, 2010
• Early Registration Deadline: February 19, 2010
• Powerpoint/Presentation file for CD-Rom due not later than: March 11, 2010 (Last day of Conference)
• Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
• Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)