5th International
Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
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Conference and Technical Workshops
March
10-12, 2009
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Exhibition and Technology Showcase
March
10-11, 2009 |
Professional
Development Courses
March 9, 2009 |
GBC
Spring Conference
March
8-9, 2009 |
In conjunction with
the Global Business Council (GBC) Spring
Conference, March 8-9
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Courtesy of FlipChip International, LLC |
Courtesy of Rensselaer Polytechnic Institute |
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General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer |
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Submit Abstract(s)
Hotel Information | Speaker Information | Exhibit Information | Reserve Booth(s) |
Professional Development Courses (PDCs)
Workshops: 3D Packaging | Flip Chip Technologies | MEMS & Associated Microsystems |
Wafer Level Packaging/CSP | Packaging & Application of Power LED Devices | Electronic Packaging for Medical Devices
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. The 2009 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging:
The Device Packaging conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading industry and academia experts in these fields. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 5, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than December 5, 2008.
HOUSING
Hotel Reservation Deadline - February 2009
Housing accommodations must be made directly to:
Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
On-line Reservations - Promotional Code: IMAPS9
Speaker Dates/Information:
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Abstracts due: December 5, 2008
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Extended Abstract or Abstract Book Materials due: January 30, 2009
- Hotel Reservation Deadline: February 2009
- Powerpoint/Presentation file for CD-Rom due not later than: March 12, 2009 (Last day of Conference)
- Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
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Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
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