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Advancing Microelectronics • Volume 28, No. 2 • March/April 2001
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New Products

ASYMTEK's New Century® C-718 for PCB Assembly

     Asymtek has introduced the Century® 718 SMT Dispensing System for use in typical PCB assembly applications - the dispensing of surface mount adhesive, solder paste, and conductive adhesive. It is designed to service both medium and high mix productions and is offered in two configurations.
     For more information, please call 760-431-1919.

FUJIPOLY's Expanded Catalog Describes Range of Electronic Packaging Products

     Design engineers developing electronic products that need to dissipate heat or make many connections in a small space can now choose from a wide range of components to meet their needs. A revised and expanded catalog is now available from Fujipoly America Corp., that gives detailed specifications and performance characteristics of hundreds of silicon electronic packaging components.
     For a copy of the catalog, please call 908-298-3850.

Zenite® from DUPONT Delivers Top Performance with Low Cost

     Relying on the toughness, heat resistance and molding productivity of DuPont Zenite® LCP liquid crystal polymer resin, Standex Electronics, Cincinnati, OH, has developed miniature power inductors delivering maximum performance at minimum cost. The inductors are engineered for surface mount board assembly in circuitry for DC/DC power converters and other devices. The inductors consist of a coil wound on a ferrite bobbin core that sits on a base injection molded from DuPont Zenite®.
     For more information, please call 248-583-7821.

3M Plays It Cool with Scotch-Weld Adhesives

     Bubbles are nice in champagne, but the last place you want them is in your adhesive. That's one of the reasons 3M is introducing a new line of premixed and frozen Scotch-Weld epoxy adhesives. After parts A and B of the new adhesives are weighed and mixed, they're degassed before freezing and the result is less bubbles and a cleaner, better bond for the end-user.
     For more information, please call 651-733-0905.

FLOMERICS Software Optimizes Thermal Management

     FLOTHERM Computation- al Fluid Dynamics (CFD) software, from Flomerics, allows design and packaging engineers to build and test computer simulations of the thermal performance of proposed handheld electronic products quickly and accurately, thereby saving the time and expense of building physical models.
     For more information, please call 508-357- 2012.

New High Power Resistive Product Line from ATC

     American Technical Ceramics has introduced a new line of resistors, terminators, and attenuators designed for microwave and RF applications. All are designed and fabricated using non-toxic, environmentally-safe aluminum nitride substrates in its ISO 9001 Registered facility. The product line can be used in applications from DC to 40 Ghz with power handling capabilities from 0.l watts to 1000 watts.
     For more information, please call 631-622-4788.

CD from OHMCRAFT Shows MicroPen in Action

     A new PC-compatible CD ROM from OhmCraft contains two video programs demonstrating the MicroPen's unique toolless technology and a broad spectrum of precision applications where traditional technologies, such as screen-printing and thin film, don't measure up.
     For a copy of the CD, please call 716-624-2610.





 






 

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