European Activities & Calendar of Events
UK:
News from the Chapter:
- Recent UK Committee Meeting.
A committee meeting held on 2nd March 01 discussed its policy and planning and concluded that the membership in general supported the direction the committee had taken over the last five years confirming that the scope of IMAPS was from Chip to System and that it was now the task to more effectively serve the needs of members.
The MicroTech event was discussed in depth to see what lessons might be learnt. One reason for the disappointing turnout was perhaps the poor state of public transport at that time. It was however thought right to repeat the event next year and the end of January or early February was considered to be the best time. Two days of technical papers were likely — probably one on Materials for Electronics and the second, Advanced Manufacturing in Microelectronics. Input on these topics would be sought from potential speakers. A number of different venues would be investigated.
Other meetings were being planned including Passive Components in the autumn of this year, a Scottish Enterprise Meeting on Microelectronics and Packaging for Industry in the spring of 2002 and Automotive Technology and Applications at the end of that year.
Due to a disappointing response from universities, the Student Prize has been cancelled for this year. General satisfaction was expressed with the new website and the inclusion of a hit counter and reduction of time delay on entering the site would be investigated.
The next meeting will take place on the 25th of May 01.
BCW
- MicroTech 2001, 28th to 30th January.
MicroTech for many years was the pivotal event for UK members of IMAPS attracting a healthy number of both visitors and exhibitors. It was a yearly get-together where a high degree of what we now call networking took place.
Some years ago it was dropped due top falling numbers and it was a bold decision by the committee when it was decided to resurrect it. All the ingredients were there as a result of hard work, particularly by Technical Chairman, Nihal Sinnadurai - central location at the Novotel, London, four days of activity and an excellent technical programme but once again the support from the UK in the form of delegates was very disappointing. Of the 42, 45 and 36 delegates that attended the three days of conference nearly half were from abroad, there being an impressive team of 6 from Nokia.
The Monday event was the Seventh European Conference on High Density Packaging surely of interest to a whole raft of electronic engineers, a subject which supports a publication all its own. The paper titles and the international speakers should be encouragement enough but the content was excellent. Topics including encapsulation, bare die imaging, effects of thermal fields, copper interconnection, properties of LTCC conductors and diffusion patterning of thick film conductors.
The high profile topic of Wireless Technologies was the subject for the Tuesday which was concluded by a satellite link up with Don Brown of IWPC. Here again the subjects were all topical - high performance packaging, microwave components in LTCC, measurement of thick film materials for wireless applications, high frequency band pass filters, LTCC for low frequencies, millimetre-wave packages and reliability testing of mobile phone circuit boards.
The third day consisted of the Second European Conference on Microsystems Packaging, again containing papers on many hot topics many of which will be the products of our industry in the future. Subjects covered were ultra-thin RFID systems, modular integrated microsystems, 3D compact packaging, anodic bonding, production packaging for microfluidic devices, photolithography for 3D structures, silicon motherboards for photonics and flexible interconnect for biological assembly.
What one does notice from this excellent programme is that we have moved on to a much more application-oriented list of topics. ISHM in the earlier days talked much more about processes and circuit manufacturers were reluctant to talk about what they were doing in front of their competitors. A programme like this has to be made available to a much wider audience which probably means earlier planning and certainly wider publicity. The 14 exhibitors would have been much happier with greater numbers.
BCW
Business Trade/Industry News:
Electronics on the Big Dipper.
Headlines like "Telecoms Nightmare" and "Slowing telecoms growth hits Motorola and Nortel" are enough to cause panic and the redundancies that have followed from the companies mentioned confirm the fears. The knock-on effect has been on many SMEs who have been encouraged to ramp up at unprecedented rates over recent months and are now having to lay off staff who they have painstakingly trained and who may in the future be reluctant to return. The UK Government is also under fire for not including the UK's support for the MEDEA European R & D programme and for failing to support Marconi's plan to create an optical communications development centre in Nottingham. Nevertheless it is optoelectronic start-up firms that often make the news these days with Optical Micro Devices expecting to be in production with 8in wafers of chips for silicon microbench structures for aligning optical chips and fibre array alignment devices.
Then there is ilotron whose optical wavelength switch is being on trial with BT.
Sendo which is a recent start-up working on 3rd generation mobile phones has recently received a substantial regional grant towards its £36m which should result in the creation of 400 mainly skilled jobs in the Birmingham area. Finally are those pleas for more engineers being heard at last. The Government has recently announced a year long drive to make youngsters more aware of science and technology. We hope that as recently suggested to me by a recently qualified engineer they don't all end up in the world of finance where the training engineers undergo is considered ideal for money dealers.
BCW
France:
Meetings Programme:
- 13th European Microelectronics and Packaging Conference
IMAPS France has the pleasure of marking the start of the third millennium by organising the 13th European Microelectronics and Packaging Conference & Exhibition.
From 30th May to 1st June 2001, Strasbourg, the parliamentary capital of the European Union, will host this important European event in its Palais de la Musique et des Congrès [Palace of Music and Congresses]. With an expected three thousand participants, IMAPS France and its partner, Golding, intend to renew their common success as in Nice in 1993.
The two-and-a-half-day cycle of conferences will offer a programme of a high scientific and technical standard with some 100 papers. In addition to the eleven oral sessions, the proceedings will include poster presentations and the award of the European Prize for the best work by a student. Broad coverage will thus be given to all aspects of microelectronics and packaging, from materials to microsystems. In addition several professional advancement courses will be available on May 29th for registered attendees.
With its 120 exhibitors, this exhibition is the largest event in Europe devoted exclusively to the microelectronics and packaging industries.
The vast space afforded by the Palais de la Musique et des Congrès will facilitate the movement of attendees, thereby optimising communication between the conference rooms and the exhibition.
Finally, so as not to overlook the festive side of such an event, IMAPS France will take advantage of the resources offered by Strasbourg and the surrounding region to invite the participants to a friendly reception in a traditional Alsatian setting.
Conference details are shown in this issue of AM.
Please check the new web site:
www.golding.fr/imaps
Email:
imaps.strasbourg.2001@golding.fr
Italy:
Meetings Programme:
May 17th and 18th, 2001, the first of two 2-days courses, titled “Introduction to Electronics Technology: Assembly, Processes and Testing” will be held in Milan, at the Politecnico of Milan, with the following programme:
May, 17th, - Interconnect and Packaging Technologies
|
| 09:00 |
Welcome. |
G. Confalonieri, IMAPS Italy
|
| 09:15 |
Technology and Market Trend. |
A. Gandelli, Politecnico MI
|
| 10:00 |
Package Road Map for High Density Electronics (BGA, CSP and MCM). |
A. Gandelli, Politecnico MI
|
| 10:45 |
Substrate Road Map for High Density Application. |
A. Gandelli, Politecnico MI
|
| 11:15 |
Coffee break
|
|
| 11:30 |
Packaging Technologies: Di-cing, Die attach, Wire bonding. |
V. Motta, ST |
|
13:00
|
Lunch
|
|
| 14:00 |
Packaging Technologies:
|
V. Motta, ST
|
| 15:00 |
Flip Chip. |
E. Zakel, PacTec
|
| 16:30 |
Coffee break
|
|
| 16:45 |
Ceramic Substrates and Passive Integration. |
Don Brown, Consulting
|
| 18:30 |
Closing
|
|
|
May, 18th, - PWB and SMT Technology and Testing
|
| 08:30 |
PWB Road Map: Technology and Processes. |
M. Weinhold, DuPont
|
|
10:30
|
Coffee break
|
|
| 10:45 |
Advance SMT Technology.
|
F. Frisoni, Siemens ICN
|
| 12:45 |
Lunch
|
|
| 14:00 |
COB Process.
|
M. Monichino, Hybritec
|
| 15:00 |
New Testing Methodologies (Boundary Scan, AOI, Rx3D, ICT).
|
A. Ganio, Spea
|
| 16:00 |
Coffee break
|
|
| 16:15 |
Functional Testing and Process Control. |
T. Rovati, Siemens ICN
|
| 17:30 |
Closing |
|
This course is addressed to university students from the scientific area and young production engineers at the beginning of their working activity.
The second (advanced) 2-days course will be held in October, 2001, and the specific programme will be informed.
For more information, call:
IMAPS Italian Chapter
Dr. L.Guizzetti
P.O. Box 210 - 27100 PAVIA - Italy
Tel. ++39 0382 302859
Fax ++39 0382 27697
E-Mail : ishmimaps@iol.it
News from the Chapter:
IMAPS Italy, pursuing its “Continuing Education” activity as one of the most important and mandatory mission of the Chapter, oriented to the domestic microelectronic market reality and demands, organizes two 2-days technical meetings: base and advanced.
The events are the continuation of the successful series of technical courses held in Italy since 1998 to stimulate domestic educational activities and spreading know-how in rapid changing areas, such as packaging, integrated passive components, SMT’s state of the art in terms of processes, productivity, quality and testing.
This activity is concerning with research, development, design, manufacture and application of materials, devices and systems, focused in the form of workshops, tutorials or professional courses and the Teachers will be specialists from different technological areas, from University and Industries.
On May 17th and 18th, 2001, the first (base) of two 2-days courses, titled “Introduction to Electronics Technology: Assembly, Processes and Testing” will be held in Milan, at the Politecnico of Milan, with the programme shown above.
Nordic:
Meetings Programme:
- IMAPS-Nordic 38th Annual Conference, Oslo, Norway, September 23-26.
IMAPS Nordic will be celebrating its 30th Anniversary with a spectacular conference.
For the latest information about the Conference and the Exhibition, visit our homepage at http://www. imapsnordic.a.se or send email to info@imapsnordic.a.se or to the Exhibition Host at exhib@imapsnordic.a.se
More info can be found on the web: www.imapsnordic.a.se
Business Trade/Industry News:
- Strand Interconnect, Sweden.
Strand has been qualified by Infineon, Germany, to supply cost-efficient plastic encapsulated multi chip leadframe packages. Time to market and product flexibility was the driver for the PDIP 2 chip module (Mixed signal ASIC and 1MB flash). Substrate cost and reliability the final issues before Infineon made the decision to choose the Strand technology.
Strand's 4-layer thin film process is based upon a 8" silicon wafer with 4 layers of Al sputtered on BCB dielectric. Lines and spaces are 20mm and 25mm, respectively. The volume manufactured p.t. is 200.000 pcs a week, which represents about 90% of the current production capacity which therefore is expected to expand during 2001. Strand Interconnect was founded in 1997 as a spin-off from IMC, now ACREO, Sweden, which originally developed the technology. More details at www.strandinter.se.
Germany:
Meetings Programme:
- Polytronic 2001, Potsdam, October 21-24
This new joint conference is incorporating Polymeric Materials for Microelectronics and Photonics Application (POLY), Adhesives in Electronics and Polymeric Electronics Packaging (PEP). The main objective is to provide a forum for experts to present their findings and innovations, and to exchange ideas on topics regarding different aspects of adhesives and polymers in microelectronic and photonics. The conference will take place at the Dorint Hotel, located in the historic center of Potsdam near Berlin, Germany.
The Brandenburg state capital, Potsdam, is actually an island in the mid of the picturesque, wooded Havel landscape, close to the metropolis of Berlin. In Potsdam, history can be lived. With the "Edict of Potsdam" of 1685, the Great Elector in practice opened the Mark Brandenburg for settlers from all of Europe. The Dutch Quarter, The Russian Colony "Alexandrowka," The Bohemian Weavers, Quarter or the churches and villas in the Italian style give the historical townscape an international flair. In 1991 the entire cultural ensemble was declared a part of the world cultural heritage by UNESCO. Our conference hotel is situated between the palace park Sanssouci and the historic town center of Potsdam.
For more information, please use fax number + 49 (0) 30 46403 161; write an e-mail to polyorg@izm.fhg.de or visit the home page http://www.izm.fhg.de/polytronic_2001/.
You are also welcome to contact using mail. Please write to Rolf Aschenbrenner, Fraunhofer-IZM, Gustav-Meyer-Allee 25, Berlin 13355 Germany; phone: +49 (0) 30 46403-160.
Business Trade/Industry News:
- Pac Tech Wafer bumping line.
Pac Tech is a leading German supplier of services for wafer bumping based upon low-cost electroless Ni/Au plating. Pac Tech has just announced that a fully automated wafer bumping line with a capacity of 50 pcs. of 4"-12" wafers per hour has been installed in Japan at Alpha Bumping Technology, Co. The customer will use the technology developed and licensed by Pac Tech to form the UBM between the Al or Cu upper metal of the chip and the solder bump in flip chip assemblies.
Pac Tech was founded in 1995 and is today a leading wafer bumping and packaging subcontractor. Pac Tech has formed alliances with companies in the US, Europe and Asia for licensing, equipment sales and contract wafer bumping services.
More info at www.pactech.de.
Poland:
Meetings Programme:
- IMAPS-Poland 25th Annual Conference
The conference will be held in a very nice mountain resort Polanczyk (close to the International Airport in Rzeszow) on 26-29 September 2001.
The Conference topics include:
- Hybrid and Semiconductor Technologies
- Design Methods and Computer Simulations
- Electronics Materials and Components
- Applications
- Thick-Film and Thin-Film Sensors
- Packaging and PCB
- Quality and Reliability Evaluation
- Thermal Management
- Optoelectronics
- Educations in electronics
- Exhibition of microelectronics circuits, materials, technology and measurement equipment
The Conference language is English.
More information can be found on our WEB page: http://www.rzeszow.pl/imaps2001
The address for correspondence:
The Technical University of Rzeszow
IMAPS 2001
W.Pola 2, 35-959 Rzeszow, Poland
Fax. (+48 17) 85-420-88, Ph.: (+48 17) 85-447-08
Or e-mail:
imaps2001@prz.rzeszow.pl
Romania
Meetings Programme:
- The Romanian Chapter is organising the 7th International Symposium for Design and Technology of Electronic Modules, SIITME 2001. It will take place September 20-23, in Bucharest.
The conference is organised by "Politehnica" University of Bucharest, Department of Electronic Technology and Reliability (TEF) Center of Technological Electronics and Interconnection Techniques (CETTI), Hydraulics and Pneumatics Research Institute Bucharest (IHP).
The general chairman is: Prof. Paul Svasta, Ph.D., “Politehnica" University of Bucharest, Center of Technological Electronics and Interconnection Techniques, Electronics & Telecomm. Faculty
e-mail:cetti@cadtieccp.pub.ro
The Call for Papers is out.
Tentative Sessions on:
- CAE - CAD - CAM for electronic packages and modules; modeling and simulation;
- electromagnetic compatibility and signal integrity analysis; electrostatic discharge;
- printing wiring board - new materials, processing, process simulation and application;
- thermal management, reliability and life time prediction;
- document management systems;
- quality management: Q- assurance, Q- control, Q- inspection;
- concurrent engineering and project management on electronic packages;
- electronic components and packaging (SMD, µBGA, CSP, FC);
- electronic and optoelectronic modules manufacturing (SMT/PCB/ MCM);
- reliability of new packaging concepts interconnection technology;
- design for environment and environmentally conscious manufacturing; clean technologies;
- optical inspection; in circuit-test systems;
- networking and Internet education.
To submit an abstract and for more information, please contact:
Dr. Norocel Codreanu, Ph.D. (Symposium Manager),
UPB-CETTI, Splaiul Independentei 313, 77206-Bucharest, Romania
e-mail: noroc@cadtieccp.pub.ro, Tel:
+40-1-4116674, Fax: +40-1-4115182
| Table of Contents | Previous Page | Next Page |
