European Microelectronics
With this issue of Advancing Microelectronics devoted to European Microelectronics we do not as usual deal with a specific theme. This time I have tried to collect papers covering a broad palette of technologies from companies and institutions in Europe.
A paper from the Tele and Radio Research Institute, Poland, deals with the actual topic of lead-free electronics. The paper focuses on the solder finish on the copper pads. Instead of and in comparison with hot air solder levelling (HASL), the paper looks at nickel-immersion gold, immersion tin and organic solderability preservatives (OSP) and eventual impact on solderability, surface insulation resistance and shear strength of the solder joints.
A second paper from a photonic research lab., Laboratoire des Systèmes Photoniques, France, describes the various ways to manufacture Diffractive Optical Elements (D.O.E.). The use of an excimer laser is described as a micro-machining process and is compared with alternatives.
Finally a third paper from Bull and MTA, France, is about a software tool to simulate time and cost for (new) materials processes. It is intended to be used for an early awareness of cost issues from almost the conceptual stage of a project. The software has been developed and used within the earlier described EU-funded project FLIPAC, to assess the cost breakdown of MCM technology demonstrators.
It has been mentioned in the Editorial, but it can not be said too often: I encourage the readers of Advancing Microelectronics to learn more about European activities in the microelectronics field. One way is of course to read the info presented in the “European Input”-section, another way is to read one of the technical papers from Europe presented in each issue of AM - but the best way is to attend one of the many European conferences. Why not start out with the European Microelectronics Conference in Strasbourg May 30-June 1st?
From the “European Input” section you will also learn about interesting local events which could benefit you in your work. Most of the National conferences have English as the conference language. You will realize the open atmosphere, quickly offering you a new, right network for your further activities.
Our aim in IMAPS is to disseminate the info on microelectronics, and life is too short to re-invent something that already has been developed. Only networking, collaboration and communication can reduce these mistakes.
IMAPS-Europe welcomes you – contact one of the chapters and we will gladly help.
Søren Nørlyng
noerlyng@micronsult.dk
Søren Nørlyng received his M.Sc.EE at the Technical University in Denmark, 1969. Since 1996 he has been Managing Director of MICRONSULT, a company consulting in Microelectronics and representing and selling products and technologies for the microelectronics industry.
Prior to MICRONSULT he was the group leader, R&D, for microelectronics at Bruel & Kjaer, Denmark.
He has more than 20 years experience in electronics packaging, interconnection and assembly covering thick and thinfilm hybrids, PCBs, PTF and micropackaging. He has authored and presented numerous technical papers and co-authored a book on PTF.
He has been the president of IMAPS-NORDIC for a period of 6 years and is currently the vice-president. He has been the chairman of IMAPS-EUROPE and was the General Chair of the 10th EMC, Copenhagen 1995. He is currently a member of the TPC, Technical programme Committee.
He is also the European editor of “Advancing Microelectronics” and Associate editor of “Microcircuits & Electronic Packaging.”
He is a Fellow of the Society.
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