2001 IMAPS/PRC Fellowship Recipients Announced
Congratulations to the following undergraduate students on being selected as recipients of the 2001 IMAPS/PRC Undergraduate Fellowship in Microelectronics. These $7,000 grants are offered to students who have taken fundamental courses in physics, chemistry, and engineering. The program is designed to introduce them to microelectronics and packaging technologies, providing an industry perspective that could ultimately lead to a career in the packaging industry.
The students will present their research findings at the 34th Annual International Symposium on Microelectronics being held October 9 – 11, 2001, at the Baltimore Convention Center, Baltimore, Maryland. Please show your support and congratulate them by attending this focused session at IMAPS 2001.
Orfirio Sanchez
Florida International University
Paper Title: Microwave Characterization of Low Temperature Cofire Ceramics with Embedded Fluid Channels
James E. Morris
TJ Watson School of Engineering & Applied Science
Paper Title: Electrically Conductive Adhesives Technology
T. Darren Brown
University of Kentucky
Paper Title: Efficient and Economical Laser Processing of Mixed Signal Packaging
Amir Alam
University of Illinois at Urbana – Champaign
Paper Title: Mechanisms of the Adhesion of Aromatic Thermosetting Copolyesters (ATSPs)/Si02 and ATSPs/Polyimides
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