|
| |
|
|
Advancing Microelectronics • Volume 28, No. 6 • November/December 2001
|
| | Table of Contents | Previous Page | Next Page | |
New Breeze from Tokyo
By Hironori Asai
 IMAPS-Japan and the Japan Institute of Electronics Packaging (JIEP) organized the International Conference on Electronics Packaging (ICEP) sponsored by the IEEE CPMT Japan Chapter from last April 18 to 20, 2001. ICEP is a new name that replaces what was previously called the IEMT/IMC joint conference. At the beginning of 21st century, the conference changed not only its name but also the host city. Whereas IEMT/IMC used to be held in Omiya, ICEP was held in Tokyo, by far the best location in terms of transportation, business and accommodation. Despite the woes of the Japanese economy, attendance at the conference exceeded 400, including some 70 people from overseas. These numbers are roughly the same as those for last year. Overseas participants were from a dozen countries, with the largest contingents coming from Korea, the United States and Taiwan. The attendance figures and the countries from which participants traveled demonstrate that ICEP is recognized as a valuable conference around the world and enjoys a particularly high profile in Asia.
The main theme of ICEP was “Open the New Century and Grow the Networking World.” Many cutting-edge studies for packaging, Pb-free solders, substrates, plating, thermal management, emerging technologies, interconnections, optoelectronics, design, and simulation were presented and discussed attentively. There are 94 presentations, more than at any IEMT/IMC conference; 66 by researchers working in Japan, 28 by researchers working overseas. These numbers underline the growing importance of electronics packaging and related topics, which constitute fundamental technologies underpinning the progress of IT. On the opening day of the conference, four keynote speakers - Dr. K. Tada (President, JIEP), Dr. G. Caswell (President, IMAPS USA), Dr. P. Barnwell (President, IMAPS Europe) and Dr. J. Yu (Vice President, IMAPS Korea) - spoke on the current status and future prospects of electronics packaging technologies, from both global and regional perspectives. They were at one on the great significance of these technologies and their global impact.
At the conference, the welcome reception was an excellent opportunity for participants to deepen existing friendships and form new ones. From the reception venue, which was in a high-rise building, everyone enjoyed panoramic views over Tokyo and Tokyo Bay as night fell. A party with an international flavor, held at a venue adjacent to the conference hall, was also a great success. This social dimension is a valuable feature of the conference. In a speech at the party, Dr. Bauer spoke for everyone when he commented that friendships grounded in trust and respect are essential to the progress both of the individual and to that of the electronics packaging field. In this respect, the conference was a resounding success.
In addition to the conference, an exhibition on electronics packaging was held in a building adjacent to the conference hall. The exhibition, larger than those held in previous years, conveyed a great deal of information and included many actual products. It attracted more than 12,500 visitors, attesting to the high level of interest in the field. The combination of conference and exhibition facilitates communication of the latest topics.
The next conference will be held from April 17 to 19, 2002. Please make a note of ICEP in your diary.
| Table of Contents | Previous Page | Next Page |
|
|
|
