President-Elect, Dr. Peter Barnwell, pbarnwell@ 4cmd.com (Newly Elected); Peter Barnwell is Director, Advanced Technologies, for Heraeus Incorporated, Circuit Materials Division, based in Pennsylvania. His long involvement with IMAPS began as a founding member of both the UK chapter and the European Liaison Committee. He served as President of IMAPS Europe (1999-2001) as well as spending several years on the IMAPS UK committee as Chairman (President) and Treasurer. A founding member of the Ceramic Interconnect Initiative (CII), Peter also holds recognition as a Fellow of IMAPS. He received his B.Sc. Applied Physics from City University, London in 1966 and his Ph.D. in 1973. Her Majesty the Queen appointed him a Member of the Order of the British Empire (MBE) in 1984 for services to industry. Peter’s industrial experience includes the founding and leadership of two hybrid microelectronics companies in the UK and serving as director of two publicly quoted venture capital organizations. In the early 1980s he helped lead development of the surface mount industry in the UK. He also held positions as Professor and Dean at Kingston University, England, and worked with several other universities.

First Past President, Mr. Greg Caswell, gcaswell@austin.rr.com; Mr. Caswell has 34 years of experience in the electronics industry. He is currently the Director–Member Services for the International Wireless Packaging Consortia (IWPC). Prior to joining the IWPC, he was responsible for Design and Prototype Technical Sales for XeTel Corporation, the Director of Operations for Galaxy Microsystems, the chief engineer for the Digital and Applied Systems Division of Tracor, and a member of the technical staff at RCA’s Solid State Technology Center. He received his Bachelor of Science in Electrical Engineering from Rutgers University and also has a Bachelor of Science in Management from St. Edwards University in Austin. Mr. Caswell has over 200 publications addressing CMOS, CMOS/SOS, input protection networks, surface mount technology and advanced packaging. He was the organizer and a contributing author to the IMAPS book entitled “Surface Mount Technology” which was the first book published on the subject in 1984. Mr. Caswell has been a member of the society since 1982, was the IMAPS Vice President in 1986 and the 1984 Centex Chapter President. He was the National Chairman for the IMAPS sponsored Advanced Technology Workshop program from 1989-2000, which produced workshops each year on different aspects of current and emerging technologies. He has received the IMAPS Technical Achievement (1986), Fellow of the Society (1993), and Daniel C Hughes Memorial Award (1995).

Treasurer, Mr. Michael Alan Stein, mstein@electroscience.com (Newly Elect- ed); Michael Stein is President of Electro-Science Laboratories, Inc. (ESL), a multinational electronic materials company. Michael attended Muhlenberg College, University of Pennsylvania, and Villanova University. Over the last 20 years he has established successful business enterprises in the United States, Europe and Asia. He has published and presented over 20 technical papers and short courses at IMAPS/ISHM, ACerS, ACS and IEEE, several of which have won “best of” awards. He is a patent holder. He has been consistently active in IMAPS/ISHM, founding the SMT/Interconnect Division and the translated “Japanese Sessions,” serving on the Technology and Symposium Committees and co-founding the IMAPS-Israel Chapter. In addition, Michael is a senior member of IEEE, a member of ADR Committee of the Pennsylvania Bar Association, a mediator of business disputes through the Montgomery County Bar Association and has been guest seminar leader and lecturer on small business management and on materials technology at the University of Pennsylvania, Muhlenberg College and Drexel University.

Vice President of Technology, Dr. R. Wayne Johnson, Johnson@eng. auburn .edu; R. Wayne Johnson, PhD., is an Alumni Professor of Electrical and Computer Engineering and Director of the NSF Center for Advanced Vehicle Electronics at Auburn University. He has established teaching and research laboratories at Auburn for advanced packaging and electronics assembly. Research efforts are focused on materials and processing for electronics assembly with emphasis on harsh environments. He has published and presented numerous papers at workshops and conferences and in technical journals. He has also co-edited a book on MCM technology and written four book chapters in the areas of silicon MCM technology, MCM assembly, hybrid technology and high temperature packaging. A member of IMAPS for 23 years, Wayne was the 1991 President of IMAPS. He received the 1993 John A. Wagnon, Jr. Technical Achievement Award, was named a Fellow of the Society in 1994 and received the Daniel C. Hughes Memorial Award in 1997. He is also a member of IEEE, SMTA, and IPC. He received the B.E. and M.Sc. degrees in 1979 and 1982 from Vanderbilt University and the Ph.D. degree in 1987 from Auburn University. He has worked in the microelectronics industry for DuPont, Eaton, and Amperex.

Vice President of Information, Dr. Aicha Elshabini, aicha@engr.uark.edu (Newly Elected); Aicha Elshabini is Professor of Electrical and Computer Engineering. She obtained a B.Sc. in Electrical Engineering at Cairo University, 1973, in both Electronics and Communications areas (five years program), a Masters in Electrical Engineering at University of Toledo, 1975, in Microelectronics, and a Ph.D. Degree in Electrical Engineering at the University of Colorado, 1978, in Semiconductor Devices and Microelectronics. She served at Virginia Tech Institution for the period 79-99, assuming the position of Director of the Microelectronics Laboratories at this Institution. She has also served at the capacity of Chair for the Electronics/Circuits Area at the Bradley Department of Electrical and Computer Engineering (for twelve years). During her career, she has worked on the board of many Industrial Companies, and volunteered work with United Nations. Currently, she is serving the position of Professor and Department Head for the Electrical Engineering Department at University of Arkansas (since July 1, 1999), and Interim Department Head for Computer Science & Computer Engineering Department (since July 1, 2000). She has been serving as the faculty advisor for IMAPS student society at both institutions since 1980 to present time. Dr. Elshabini is a Fellow member of IEEE/CPMT Society (1993) Citation for ‘Contribution to The Hybrid Microelectronics Education and to Hybrid Microelectronics to Microwave Applications,’ a Fellow member of IMAPS Society (1993), The International Microelectronics and Packaging Society, Citation for ‘Continuous Contribution to Microelectronics and Microelectronics Industries for numerous years.’ Dr. Elshabini was awarded the 1996 John A. Wagnon Technical Achievement Award from IMAPS. She has served as the Editor of the IMAPS International Journal of Microcircuits & Electronic Packaging for 10 years.

Secretary, Mr. Robert Warren, robert .warren@conexant.com; Robert Warren is Manager of Advanced Packaging Development at Conexant Systems in Newport Beach, California where he is currently focused on the development and implementation of flip chip packaging for wireless com- munications and personal computing app- lications. Prior to this he was Director of Engineering and Quality at Flextronics in Anaheim, California, and he has also held engineering or operations management positions at Raytheon, Grumman Space Systems, and Hybridyne, where he helped develop a variety of packaging technologies for implementation in leading edge applications such as the F-22 stealth fighter, the Army’s infrared thermal weapon sight, several commercial and military communication satellites, as well as many high volume consumer products. Bob is currently serving his second term as Secretary for IMAPS and has served in a number of other positions within IMAPS such as Southern California Regional Director, Chapter President, and a variety of chair positions for local and national technical conferences.

Organizational Director, Mr. Richard E. Sigliano, rsigliano@zecal .com (Newly Elected); Mr. Sigliano has 26 years of experience in the hybrid microelectronics and semiconductor packaging industry. During the past 15 years, Rick has been involved in the IMAPS Technical Society serving four years as chapter President (2 years), Program Technical and Sponsor Chairs. Rick has supported technical events contributing with papers at both the local chapter and national levels. In addition Rick has served as Program Chair for the SoCal symposium. On the national level, Rick currently chairs the Thin and Thick Film Subcommittee as part of the National Program Technical Committee and holds the General Chair of the High Speed Digital ATW. Past responsibilities include: Program Chair for the Int’l MCM Conference and Session Chair for numerous symposiums, conferences and ATWs. He also served on the committee for the Los Angeles symposium in 1995 and the San Diego symposium in 1998.

Northeast Regional Director, Ms. Tania M. Keefe, Tania@riv inc.com; Tania Keefe is the Manager of Sales and Services at Riv Inc.-Thick Film Screens, Merrimack, NH. She has been employed with Riv for fourteen years after receiving her degree in Business Management. Tania has been actively in-volved with the New England Chapter for the past eight years and has held such positions as Secretary and Registration Chairperson.

North Central Regional Director, Mr. Lawrence J. Rexing, rexing@4cmd.com; Larry Rexing has been a member of ISHM/IMAPS for over 15 years. He has more than 25 years experience in the thick film and packaging industry. Most of this experience was with CTS Corporation. Larry is currently employed by Heraeus Incorporated, Circuits Materials Division, as their Midwest Regional Sales Manager, a position he has held for 4 years. He has a BSEE degree from Purdue University. Larry has held many leadership positions with the Indiana chapter, including Chapter President. He also helped organize and initiate the First MCM workshop, in Napa Valley.

Mid-Atlantic Reg. Dir., Dr. Bruce Romenesko, bruce.romenesko@ jhuapl.edu (Newly Re-Elected); Bruce Romenesko has worked in micro- electronics and packaging for 22 years, including the sub-fields of thin and thick films, process development, assembly, and instrument level packaging. He has been involved in IMAPS/ISHM for that length of time; he serves on the National Technical Committee as chair of the Interconnections, SMT and Flex Circuitry subcommittee, and is entering his second term as Mid-Atlantic Regional Director. He holds a Ph.D. in solid-state physics and a B.S. in mathematics and physics.

Southeast Regional Director, Mr. Mike Newton, mnewton@harris.com (Newly Elected); Mike Newton is the manager of the MicroSystems Technology group at Harris Corporation. He has twenty-four years experience in process development, design in advanced microelectronic packaging and strategic technologies. His recent emphasis is in sensor technology, advanced dielectrics and MEMS fluidic cooling. Mike has received ten patents and currently has six additional patents submitted. The Charter of the Microsystems Technology Group includes investigating emerging technologies, electronic materials development, and University/National Lab/small business alliances.

Southwest Regional Director, Mr. Frederick R. Hyatt, fred@thusa.com (Newly Elected); Frederick R. Hyatt has been active IMAPS since he began his work with Tong Hsing Electronic Industries, Ltd. 14 years ago. He has participated in both the Tucson and Phoenix Chapters and been involved with several conferences and society sponsored events. He has served as President of the Phoenix Chapter. Professionally, he has worked in several capacities for AT&T International, Caterpillar Tractor Co., and consulted with EPH Engineering Associates. This breadth of experience is built on a strong educational foundation as he holds a Bachelor of Science degree from Brigham Young University and a Master of Business Management degree from Northwestern University. Currently, he is the Manager of Business Development for North America at Tong Hsing Electronic Industries, Ltd. and is responsible for the operations of its U.S. office.

Northwest Regional Director, Mr. Anwar A. Mohammed, anwar.mohammed@ ultrarf.com (Newly Elected); Anwar Mohammed graduated in 1977 with a B.Sc. Degree in Chemical Engineering from Indiana Institute of Technology in Fort Wayne, Indiana. Obtained his MBA from St. Edward’s University in Austin, Texas in 1983. He is presently pursuing his M.Sc. in Microelectronics Packaging at San Jose State University with a graduation date of December 2001. Anwar has been involved with the microelectronics industry since 1977 when he joined CTS in Berne, Indiana as a R& D Engineer, fresh out of college. He has worked in different roles in many different companies like CTS, Zenith, National Semiconductor, Micro Module Systems, Spectrian and now he is a Senior Manager at Ultra RF, a state of the art wireless company dealing with Si and SiC wireless devices. Ultra RF is a division of Cree Inc. Anwar has authored and presented many papers in the microelectronics field, a good number of them under the aegis of IMAPS. He has also co-authored several patents in the microelectronic industry. He has been a member of IMAPS as early as 1978 working with the Indiana Chapter, during his employment with CTS. He was also the General Vice Chair for IMAPS during the International Silver Jubilee Symposium and Conference in San Francisco in 1992.

South Central Regional Dir., Mr. Roger L. Cadenhead, cadenhead2@ worldnet.att.net; Roger Cadenhead, an IMAPS Fellow, has been a member of the Society since 1972. He was elected President’s Award winner of IMAPS (only second such award), and is Founder of North Texas chapter of IMAPS; and co-founder of Central Texas Electronics Association (CTEA). Holding several degrees from Amber University, University of Texas at Dallas, and UT at Arlington, Roger’s experience is extensive in the areas of Quality and QS/ISO implementation, and includes teaching, training, and instructing; process and technology development and invention; and an author of engineering and scientific texts. He has been Certified ISO9000 Lead Auditor (Perry Johnson, Inc.); an ASQ Certified Quality Engineer; and a NCR Certified Lead Auditor. Currently, he is Quality Manager/ISO Management Representative, NCR Corporation, where he is a Trainer in the programming and use of software packages to fully operate a SMT line, particularly the pick & place function; lean (TQM -- 6 sigma) manufacturing, kaizen team events -- continuous improvement techniques (Black Belt), and a trainer of 14 different statistical courses. He has been selected as TexCen award (IMAPS) recipient for microelectronics excellence.

Southern California Regional Dir., Mr. Phillip J. Zulueta, phillip.j.zulueta @jpl.nasa.gov; Phil Zulueta, Southern California Regional Director, is Manager, Applications Engineering Group, Quality Assurance Office, Jet Propulsion Laboratory, Pasadena, CA. There, he manages a team of engineers and technologists involved in a variety if disciplines including Electronics Packaging Technology, Non-destructive Evaluation, Workmanship Training and Certification, Mechanical Measurement Assurance and Electro-Static Discharge (ESD) Control. Phil is also Electronics Packaging Project Manager and Program Element Manager for the NASA-wide Electronic Parts and Packaging Program. Prior to joining JPL, he was Western Regional Manager for Electro-Science Laboratories, a Program Manager for Ball Aerospace Microelectronics, an Engineering Group Manager for Hughes Microelectronics and a Microelectronics Process Engineer for Northrop Electronics. Phil holds a MBA from Pepperdine University and a BS in Materials Engineering from California State/Long Beach. He has been a member of IMAPS since 1979 and currently is IMAPS Technical Sub-Committee Chairman for Photonics and Past-General Chairman for the IMAPS Southern California Regional Symposium. Phil has held various offices and appointed positions at the local chapter level including Past-President of the Orange Chapter of ISHM, and has been associated with SMTA and SID (Society for Information Display).