ATV Adds Robotics to Thermal Process System
ATV Technology, Inc., has added integrated robotics to the SRO-704 Thermal Process System, making for a completely automatic cassette-to-cassette process.
The addition, which utilizes GENMARK™ robotics, means less labor while still providing a void-free product.
For more information, please call 978-664-1948.
KYOCERA Flip Chip Build-Up Packages Pass 260°C Solder Reflow Testing
Kyocera has introduced the industry’s first flip chip build-up substrate capable of withstanding 260°C solder reflow necessary for lead (Pb) free processing. The High Density Build UpO(HDBUO) package has been qualified by multiple IC suppliers and assembly subcontractors, and is in volume production today. Kyocera’s semi-additive build-up process provides the densities needed for high pin count flip chip products; commercial products are available in 200m flip chip bump pitches, with 25m lines, 27m spaces and 50m laser vias.
For more information, please call 858-576-2793.
Wet Chemistry Heaters to 180°C from SSEC
Solid State Equipment Corp. has announced a new acid heating system in Trilennium™ wet cleaners and processors that increase both heating capacity and control capability. Heaters can be configured for flows from 100 ml/minute to 2 1/minute, depending on processing requirements.
For more information, please call 215-328-0700.
TECAN Manufactures Stress-Free Hybrid Lid
Tecan Components produces burr and stress-free lid technology through specialized design and manufacturing techniques. Tecan’s precision etching creates lids with repeatable accuracy, with no burrs, irregular edges or other damaging stresses as well as being able to etch part numbers, company contact information, and other data directly onto the hybrid lids.
For more information, please call 1-877-998-3226.
Customizable Gold-plated Contact Connector New from FUJIPOLY
Fujipoly America Corp. introduces the P Connector for use in portable electronics products. The P Connector provides design engineers with a customizable high performance interconnect device ideal for today’s increasingly miniature electronics packaging, particularly cell phones. The P Connector’s contacts can be arranged in accordance with any design consideration.
For more information, please call 732-969-0100.
MICRO PRINTING Introduces a New Alignment Tool
Micro Printing Systems (MPS) has introduced a new alignment system tool for alignment of its XY table to the squeegee and screen areas. Introductory price is $195.00 and they are in stock. This provides the customer a way to keep their screen printers in top working condition.
For more information, please call 626.330.5592.
MicroCure 5100 and 2100 Curing Systems from LAMBDA TECH
Lambda Tech’s MicroCure 5100 and MicroCure 2100 curing systems feature patented Variable Frequency Microwave (VFM) technology which allows faster curing of standard, off-the-shelf, polymeric adhesives used to encapsulate electronic components or attach them to circuit boards. The process is completed without hot spots and arcing of conventional microwave technology.
For more information, please call 919-462-1919.
New Guide on CD “5 Steps to Lead-Free Soldering” offered by VITRONICS SOLTEC
Vitronics Soltec has announced the availability of a new comprehensive guide “5 Steps to Lead-Free Soldering,” complete on an interactive CD and available free-of-charge. The CD is a culmination of Vitronic Soltec’s program developed and proven successful in multiple production manufacturing environments.
The CD is easy to navigate, user friendly, and designed to lead the user carefully through the process.
For more information, please call +31-162-48300.
New Laser Router from RESONETICS
RESONETCS Offers the New Laser Router, a precise micromachining system developed specifically for non-contact processing of silicon wafers and other semiconductor materials. The Laser Router has automatic, motorized features that allow the operator to fabricate any shape device including arcs, circles, or any complex pattern.
For more information, please call 603-886-6772.
MDE Series 20™ Cure Monitor from HOLOMETRIX MICROMET
Holometrix Micromet has introduced the latest addition to its line of cure monitoring systems, the MDE Series 20™. The MDE Series 20™ is a high-performance dielectric measurement system designed for both laboratory dielectric analysis of polymers and in-process cure monitoring of thermosets. It enables users to study the curing behavior of the materials used in the laboratory and in actual processing environments.
For more information, please call 1-800-686-6738.
New Line of High Frequency Chip Resistors from SOTA
State of the Art (SOTA) has introduced a new line of high frequency chip resistors. These compact, lightweight resistors are designed specifically for use in microwave and RF applications. The SOTA RF Series 0402 thin film chip resistors provide low return loss in frequency ranges to 16Ghz. These devices are ideal for use in circuitry requiring superior RF and microwave performance.
For more information, please call 215-453-8700.
GSI LUMONICS Introduces the WaferMark® FOUP System
The WaferMark® FOUP System for 300mm wafer traceability from GSI Lumonics uses laser technology to place permanent, highly visible marks on wafers to allow traceability of the wafers throughout the semiconductor process. It provides the compatibility, cleanliness levels, mark quality, and reliability required to support high volume production of 300mm wafers.
For more information, please call 248-449-8989.
EMERSON & CUMING Releases Series of STYCAST® Encapsulants
STYCAST® E 1050, E 2502 and E 2517 encapsulants from Emerson & Cuming offer protection from temperature extremes, from -40° to +200°C, and chemical exposure commonly encountered in automotive under-the-hood applications. All three materials are one component, heat curable epoxy encapsulants with viscosity values ranging from 14,000cP to 25,000cP at room temperature.
For more information, please call 978-436-9700.
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