The Journal Goes Electronic!
The International Journal of Microelectronics and Electronic Packaging has gone electronic. It is now being published on the IMAPS website and is accessible to all members, allowing individual papers to be printed by the reader. The economic advantages of this step are significant, permitting the same high quality publication to be provided to the membership at a fraction of the cost of the printed version.
Publishing the Journal electronically has other advantages as well. We are adding a “Comments” section that will allow readers to make comments about and additions to the papers or ask questions of the authors on line. Further, the papers will be available much sooner than before since the time required for printing and mailing has been eliminated.
Otherwise, very little has changed. For the past 10 years, under the outstanding guidance of Dr. Aicha Elshabini, the Journal has progressed to a publication that is respected worldwide as a forum for discussion about Microelectronics and Electronic Packaging. Each article will continue to be subjected to the same peer review process as before, assuring that the information is as up-to-date and correct as possible. The peer review process is integral to the high quality and prestige that the Journal enjoys and will remain in place.
At the same time, we realize that some members still prefer the printed copy, as well as our institutional and corporate subscribers. IMAPS will continue to provide a printed copy in the same format at the existing rate. All members interested in a printed copy may subscribe by simply accessing the IMAPS website at WWW.IMAPS.ORG.
The Journal plays an important role in fulfilling the original charter of IMAPS, to disseminate information to the membership. We believe that these changes will improve the quality of the Journal by permitting more reader interaction with the authors and with other members. We invite your comments on the Journal. Please feel free to contact me at jesergent@IMAPS.ORG.
Articles for the IMAPS Journal
We invite IMAPS members and all individuals involved in related technologies to submit articles for the International Journal of Microelectronics and Electronic Packaging. The IMAPS Journal is a prestigious, refereed publication distributed worldwide to IMAPS members, educational institutions, and corporate libraries.
Complete information for publication may be found on the IMAPS website at WWW.IMAPS.ORG. In summary:
• All submissions must be in electronic format, either on a disk or preferably by E-Mail.
• The Transfer of Copyright form must be filled out on the IMAPS website.
• Papers should preferably by written in Microsoft Word.
• Tables, graphs, and photographs should be submitted as separate files rather than imbedded in the text.
• Photographs and other illustrations should preferably be submitted in JPEG or WMF format. Originals may also be submitted.
Authors of papers that have been printed in IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.
Peer review is an important part of the integrity and quality of the Journal. As a follow-on to the publication of the Journal on the IMAPS website, we plan to incorporate the entire review process on-line in the near future. This should simplify and speed up the review process dramatically.
We invite your suggestions on how to improve the Journal in any way.
