Thanks to a high level technical programme, the conference attracted the attention of three hundred registered attendees each day. Sixty-five oral papers from thirteen countries were shared in eleven sessions and twenty-five additional papers were selected for a poster presentation. Fifty percent of the papers describe industry projects, twenty-eight percent research laboratories work and the rest mixed lab/industry programmes.
In the same time the exhibition gathered 104 exhibitors on 1100 m2 and was visited by a thousand of visitors each day.
In addition, before the opening of the conference, an R&D workshop, on Tuesday. May 29, was dedicated to the European effort supporting Microelectronics, Packaging/Interconnection and MEMS technologies thanks to cooperative R&D programmes and networks.
Professional development courses on Laser in packaging applications and on HDI printed circuits were held on the same day.
As before, this IMAPS Europe was the occasion for awarding the best paper, the best poster and the best student presentations.
The best paper prizewinner was S.N. Heffington for his presentation of “Vibration Induced Droplet Atomisation Heat transfer for microelectronics thermal management”; the author and his co-authors, Ari Glezer and W.Z. Black are with the Georgia Institute of Technology.
The Best Poster, entitled “The PSGA, a lead-free CSP for high performance and high reliable packaging” was presented by E. Driessens (IMEC) and had been prepared with A. Chandrasekhar (IMEC), E. Beyne (IMEC), J. Van Puymbroek and M. Herman (Siemens).
The first European Prize for students ( 1000) was awarded Manuel Flury, Laboratoire des Systèmes Photoniques/ENSPS, Illkirch – France, for his work on “Rapid prototyping of Diffractive Optical Elements (DOEs) for packaging applications.”)
Formerly winner of the French prize, a short version of his paper has been published in Advancing Microelectronics May-June issue. The full paper is now published in this new issue.
Three second prizes ( 500) were awarded Peter Gordon Department of Electronics Technology, Budapest University of Technology and Economics (Hungary), Tomasz Zawada, Wroclaw University of Technology, Institute of Microsystem Technology (Poland) and Alexander Neuman, Fraunhofer Institute for Reliability and Micro-integration (IZM), Berlin, Germany.
Besides these technical aspects and thanks to a very pleasant weather – 3 days with clear sky and 30C -, the participants have had the opportunity to enjoy the beautiful site of Strasbourg.
From the ELC meeting you will see the outgoing IMAPS-Europe Chairman, Dr. Peter Barnwell, Heraeus Circuit Materials Div., welcoming the new Chairman for the next 2 years, Dr. Karel Kurzweil, Bull. The ELC committee praised the excellent and hard work of Peter in his 2 years duty for IMAPS-Europe and thanked him for his dedication and time spent for the Society for more than 30 years! ELC then welcomed and looked forward once more to be chaired by Karel.
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