The Ceramic Interconnection Initiative (CII) Europe was founded at the IMAPS Europe Conference in Strasbourg, France, May 2001.
A new organisation, the CII, Europe, has been founded at the conference of IMAPS Europe. The inaugural meeting took place on 31 May 2001, with the objective to organise the activities of the Ceramic Interconnect Initiative in Europe.
The organisation is formed by volunteers from a wide variety of backgrounds and company affiliations with the goal of promoting ceramic technology toward solutions in electronic interconnection. Present at the meeting were representatives of the CII, USA and the constituent members of the CII, Europe. The meeting was held under the chairmanship of Terho Kutilainen, Aspocomp Group Oyj, Finland. The other participants and constituent members were Quentin Reynolds, Heraeus Materials Limited, UK, Roger Gee, DuPont (UK) Ltd, Jouko Vöhökangas, University of Oulu, Finland, and Jean-Pierre Bertinet, Thales Microelectronics, France. The representatives of the CII, USA, were Samuel J. Horowitz, DuPont Microcircuit Materials and Peter Barnwell, Heraeus.
In the beginning of the existence of the CII some individuals from Europe were invited to meetings in the U.S. The CII in Europe originally started within IMAPS Nordic, who, in 1997, decided to support the Ceramic Interconnect Initiative (North America) after the merger of ISHM and IEPS. In 1998 IMAPS Nordic suggested to the European Liaison Committee (ELC) of IMAPS to nominate Terho Kutilainen to represent the European Chapters in the CII. This became effective at the beginning of 1999 and finally ended in the founding of the CII Europe after consultation between interested parties.
At the meeting the need for this kind of activity in Europe was clearly expressed. The CII has been working successfully in the USA since 1997 and its active members have organised a great number of advanced technical workshops and other presentations to the electronics industry. The purpose is to create awareness of the possibilities ceramic technologies can offer to electronics. A result of this work was recently seen at the International Wireless Packaging Consortium Meeting in Nice, 2001, the major telecom companies had ceramics firmly placed in their technology road maps. The increasing discussion and publicity about Low Temperature Co-fired Ceramic (LTCC) is a clear example of how prominent development of ceramic technologies can benefit electronics technology.
The meeting discussed the organisation of the CII in Europe, deciding to organise CII Europe as part of the larger CII and as an IMAPS initiative. — “IMAPS is widely known in the industry and this gives a credible basis to the CII” was Sam Horowitz’ advice to the meeting. He and Peter Barnwell supported the new organisation in order to promote the ceramic industry and to globalise the CII activities by connecting European players together with those in North America.
It was recognised that success would come from open participation and collaboration with the members of the CII and that all contributions and ideas for promoting ceramic technology would be welcomed.
At the conference, CII Europe presented a stand-alone non-stop lap top show. This was debuted for the first time in Europe at the Electronics Production and Packaging Technology Conference in Pori, Finland, May 2001.
For the CII Europe: Terho Kutilainen, Chairman
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