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Advancing Microelectronics • Volume 28, No. 5 • September/October 2001
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IMAPS 2001  -
Exhibitors & Booths
(as of 8/1/2001)
| Company |
Booth Number |
| 3M Electronic Adhesives Systems Dept. |
524 |
| 3M Electronic Products Division |
1306 |
| Accu-Tech Laser Processing |
703 |
| Advanced Ceramics Corp. |
1226 & 1228 |
| Advanced Chemical Company |
1308 & 1310 |
| Advanced Packaging/Pennwell |
402 & 404 |
| AI Technology, Inc. |
607 |
| AIM, Inc. |
1428 |
| Air Liquide |
1229 |
| American Etching & Mfg. |
1107 |
| American Technical Ceramics |
417 |
| AMETEK Specialty Metal Products |
1208 |
| AMI/Presco |
1203, 1205, 1302, & 1304 |
| Amitron |
1026 & 1028 |
| Anatech |
911 |
| ANCeram GmbH & Co. KG |
403 & 405 |
| Applied Laser Technology |
512 |
| Asahi Techno Glass Corp. |
636 |
| AST Products |
1207 |
| Asymtek/Nordson |
811 |
| ATV Technology, Inc. |
528 |
| Azimuth Electronics, Inc. |
707 |
| Bar-Lo Carbon Products |
319 |
| Batten and Allen |
406 |
| Bell Technologies, Inc. |
825 |
| Benchmark |
1102 & 1104 |
| BTU International |
710 & 712 |
| C.W. Price |
802 |
| CAD Design Software |
401 |
| CAD/Art Services, Inc. |
411 |
| CCT Laser Services, Inc. |
705 |
| Central Semiconductor Corp. |
1320 |
| Ceramics Process System |
1021 |
| CeramTec NAEA |
1303 |
| Ceratek |
335, 337, 436 |
| Chip Supply, Inc. |
916 & 918 |
| Chipbond Technology Corp. |
1309 |
| Chomerics, Div. of Parker Hannifin Corp. |
805 |
| Cirqon Tech. |
927 |
| Clean Tech Magazine |
419 |
| CMP |
1404 & 1406 |
| Cobehn, Inc. |
1022 & 1024 |
| Coining Corp. of America |
929 |
| Compunetics |
311 |
| CoorsTek |
1103 & 1105 |
| Co-planar, Inc. |
508 |
| Creative Automation Co. |
530 |
| Crystal Mark |
822 |
| Curamik Electronics, Inc. |
400 |
| Cyber Technologies |
838 |
| Dage Precision Industries |
600 & 602 |
| Delta-V Ceramic Tech. |
709 |
| Deweyl Tool Company |
731 |
| Disco Hi-Tec America, Inc. |
527 & 529 |
| Dow Corning Corp. |
428 |
| DuPont Microcircuit Materials |
500 & 502 |
| Dyconex, Ltd. |
807 |
| Dymatix |
825 |
| Dynaloy, Inc. |
1325 |
| Dynatronix, Inc. |
1323 |
| Eberts Microelectronics, Inc. |
620-622 |
| Eco-Snow Systems, Inc. |
727 |
| Electro Scientifc Industries |
601 |
| Electronic Packaging & Production |
720 |
| Electronics Cooling |
1326 |
| Electro-Science Labs. |
1003, 1005, & 1007 |
| Electrovac |
517 |
| Emerson & Cuming |
1217, 1219, 1316, & 1318 |
| Epoxy Technology |
613 & 611 |
| ES Components |
1025 |
| ESEC |
1008 |
| EV Group |
922 |
| EVI, Inc. |
829 |
| EXAKT Technologies, Inc. |
821 |
| F&K Delvotec |
1403 |
| Fancort Industries |
806 |
| Ferro Electronic Materials |
917 |
| Film Microelectronics |
303 |
| Finetech |
720 |
| Flomerics, Inc. |
305 |
| Flow Autoclave Systems, Inc. |
434 |
| Fluent, Inc. |
1404 |
| Foranne Mfg. Co. |
910 |
| Fotofab |
826 |
| Fraunhofer Institute - IKTS |
403 & 405 |
| Fujipoly America Corp. |
425 |
| Gaiser Tool Co. |
1111 |
| Gannon & Scott, Inc. |
301 |
| Geib Refining Corp. |
831 |
| Gel-Pak/Quik-Pak |
628 |
| General Wire & Stamping |
304 |
| Global SMT & Packaging |
623 |
| GPD Global |
1223 & 1225 |
| Graftech, Inc. |
729 |
| Graphite Concepts, Inc. |
809 |
| Haiku Tech |
804 |
| Harrop Industries/A.J. CarstenCo. |
908 |
| HEI, Inc. |
1311 & 1313 |
| Heraeus-Circuits Materials |
717 |
| Holometrix Micromet |
518 |
| Hybond, Inc. |
1227 |
| Hybrid Screen Techologies |
1009 |
| IC Interconnect |
711 |
| Indium Corp. of America |
817 & 819 |
| Instron Corp. |
310 & 312 |
| Interconnect Systems |
504 |
| ITT Industries - MicroElectronics Center |
1312 |
| JMAR Precision Systems, Inc. |
1406 |
| Karl Suss America, Inc. |
1222 |
| Kluwer Academic Publishers |
329 |
| Kyocera America |
902 & 904 |
| Kyzen Corp. |
606 |
| L. Gordon Packaging |
617 |
| Lambda Physik USA, Inc. |
1328 |
| Lambda Technologies, Inc. |
523, 524, 525 |
| Laser Processing Technology |
718 |
| Laser Services, Inc. |
416 & 418 |
| Laser Tech, Inc. |
1206 |
| Laserage Technology Corp. |
923 & 925 |
| Lasereliance Technologies |
1212 |
| Litron, Inc. |
734 |
| Loctite Corp./Dexter Elec./Power Devices |
1327 & 1329 |
| M/A COM |
408 |
| March Plasma Systems/Nordson |
1202 & 1204 |
| Marpet Enterprises (MEI) |
1305 |
| Mathis Instruments |
213 |
| Metal Matrix Composites |
435 |
| Metallix, Inc. |
1421 |
| Metech, Inc. |
1211 & 1213 |
| Micro Printing Systems |
634 |
| Micropac Industries, Inc. |
906 |
| Microscreen (Syscon) |
618 |
| Micross Components Corp. |
824 |
| Midas Technology, Inc. |
1106 |
| MIDAS Vision Systems, Inc. |
644, 646, 648 |
| Minco Technology Labs. |
737 & 739 |
| Mini-Systems, Inc. |
1013 |
| Mitsui/Denstronics |
1010 |
| MMC - Microelectronics Modules Corp. |
1122 |
| Morgan Advanced Ceramics (GBC, Alberox) |
1127 & 1129 |
| MRSI |
1123 & 1125 |
| Multi-Fineline (M-FLEX) |
1209 |
| Murakami Co., Ltd. |
506 |
| Nabertherm LLC |
526 |
| NanoPierce Technologies |
1402 |
| Nanotechnologies, Inc. |
316 |
| National Semiconductor |
1126 & 1128 |
| National Training Center for Microelectronics |
317 |
| Nippon Steel Chemical Corp. |
1307 |
| NIST - Advanced Technology Program |
519 |
| NorCom Systems, Inc. |
1423 & 1425 |
| Northeast Electronics Corp. |
604 |
| NTK Technical Ceramics |
828 & 830 |
| OhmCraft, Inc. |
834 & 836 |
| Olin Aegis |
619 |
| Oneida Research |
736 |
| Orthodyne Electronics |
1116, 1118, & 1120 |
| P/M Industries, Inc. |
1124 |
| Pac Tech GmbH |
637 |
| Pacific Aerospace & Electronics |
924 & 926 |
| Pacific Trinetics Corp. |
625 |
| Pacific Western Systems |
1419 |
| Packaging Research Center at Georgia Tech. |
205 |
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| Palomar Technologies |
511 |
| Parelec, Inc. |
1023 |
| Patapsco Designs, Inc. |
407 |
| Perfection Products |
520 & 522 |
| Photofabrication Engineering, Inc. |
516 |
| Plasma Etch, Inc. |
1417 |
| Plasmatic Systems |
427 |
| Polaris Electronics Corp. |
1109 |
| Premier Mill Corp. |
503 |
| Presidio Components |
1002, 1004, & 1006 |
| Probotech, Inc. |
803 |
| Promex Industries, Inc. |
735 |
| Questech Services, Inc. |
621 |
| RD Automation |
907 |
| Reinhardt Microtech AG |
638 |
| Reldan Metals, Inc. |
626 |
| RemTec |
413 |
| Research Devices, Inc. |
907 |
| Resonetics Inc |
1224 |
| Rigsby Screen & Stencil |
930 |
| Riv, Inc. |
635 |
| RJR Polymers, Inc. |
505 & 507 |
| Royce Instruments |
723 & 725 |
| Saint-Gobain Adv. Pkg/Microelec. (formerly Carborundum) |
1029 |
| Saint-Gobain Performance Plastics |
1027 |
| Sarnoff Corp. |
1422 |
| ScanCad International |
1221 |
| Schiller Automation Systems, LLC |
1210 |
| Schott Electronic Packaging |
1017 & 1019 |
| SEFAR/MEC |
706 & 708 |
| Semi Dice, Inc. |
1110 & 1112 |
| Semiconductor Equipment Corp. |
713 |
| SEMX (Polese & SPM) |
722 & 724 |
| Sierra Therm Vacuum Products Group |
537 |
| Sierratherm |
535 |
| Sikama International, Inc. |
1117 |
| Sinclair Manufacturing Co. |
534 |
| Solid State Equipment Corp. |
903 & 905 |
| Sonix Inc. |
510 |
| Sonoscan, Inc. |
1113 |
| Sophia Wireless |
624 |
| Speedline CAMALOT |
201 & 300 |
| Speedline Accel |
201 & 300 |
| SST International, Inc. |
629 |
| State of the Art |
1002, 1004, & 1006 |
| Stellar Industries Corp. |
421 |
| Superior MicroPowders |
420 & 422 |
| Systems & Technology International, Inc. |
1108 |
| Tecan Components |
920 |
| Technical Materials, Inc. |
1011 |
| Teledyne Interconnect Devices |
813 |
| Teledyne Microelectronics |
912 |
| TELEPHUS |
827 |
| ThermAluminum Materials, LLC |
1516 & 1518 |
| Thermoset, Lord Chemical Products |
1012 |
| Toshiba America/Adv. Materials Division |
1412 |
| Trebor Instrument Corp. |
913 |
| UltraSource, Inc. |
207 |
| Ultron Systems, Inc. |
909 |
| Unichem Industries |
1317 |
| Unitive Advanced Semiconductor Packaging |
1427 & 1429 |
| US Tech |
609 |
| Utz Engineering, Inc. |
530 |
| Valley Design Corp. |
412 |
| Vigitek-Stratus, Ltd. |
429 & 431 |
| Viox Corp. |
616 |
| Viscom, Inc. |
1322 & 1324 |
| Vishay Intertechnology, Inc. |
307 & 309 |
| Voltage Multipliers |
928 |
| Wadsworth-Pacific |
211 |
| West-Bond |
808, 810, & 812 |
| Yield Engineering |
313 |
| Zecal Technology, LLC |
501 |
| Zymet, Inc. |
716 |
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