Book Review
Fundamentals of Microsystems Packaging
by Rao R. Tummala
The book “Fundamentals of Microsystems Packaging” (McGraw-Hill, 2001), by Dr. Rao Tummala (McGraw-Hill, 2001), has something for everyone who is involved in the electronics packaging industry, from the beginning student to the practicing professional.
He begins with a broad overview of packaging technology, including a fascinating capsule history of the major developments in the electronics industry, and continues with treatises on every major topic related to packaging, including optoelectronics, RF packaging, passive components, reliability, silicon processing, electrical test, materials, thermal management, and many others.
This is a book to take on a trip, to read over lunch, or to gain a grasp of the fundamentals of a particular topic in a short time. The material is presented in such a manner as to be understandable by those with limited knowledge of the topic, yet in sufficient depth as to be useful to those seeking answers to highly technical questions.
Although many notable authors have contributed to the subject matter, it is presented in a consistent style as though the same author wrote all the chapters, making the book much more readable. The book is presented in two colors, which makes the illustrations and graphs more understandable.
It is intended for use as a college textbook and fills a notable gap in this area. The homework problems at the end of each chapter provide for self-teaching by allowing the reader to determine their level of understanding of the material.
In summary, this book is an essential reference for anyone, technical or non-technical, involved in or related to the electronics packaging industry, including engineers, students, managers, or purchasing agents. I highly recommend it.
Dr. Jerry Sergent, Reviewer
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