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Advancing Microelectronics • Volume 29, No. 1 • January/February, 2002
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European Activities & Calendar of Events
ELC:
The European Liaison Committee has had a meeting in Friedrichshafen 10.11.01.
Friedrichshafen is the city to host the 2003 European IMAPS Conference organised by IMAPS-Germany.
Based upon the tour to the conference and exhibition center, the surroundings and the location I can gurantee that we can expect a fantastic event. The conference site is in walking distance from all hotels, it has a perfect size for two parallel sessions and a big exhibition.
The conference center is placed at the seaside of the Boden Sea (Lake Constance), bordering Switzerland and Austria.
Status on 2001 IMAPS-Europe conference in Strasbourg, France: This succesful conference had 300 attendees, 1.000 visitors and 104 exhibition booths.
The status of the coming IMAPS-Europe Symposium in Cracow, Poland, June, 2002, was presented by the conference chair, Dr. Selim Achmatowicz, and the ideas and plans regarding the 2003 Conference in Friedrichshafen were presented by the conference chair, Prof. Heiz Osterwinter and the Programme chair, Dr. Jens Müller.
Future Symposia and conferences were discussed and some suggestions were made. Hopefully soon when the official ELC report is made, we can share these details with you.
At the meeting IMAPS-Russia was formally accepted as a European IMAPS Chapter.
Please see the IMAPS-Russia section below. Paul Collander, IMAPS-Nordic President, was thanked for his involvement and enthusiasm to make this happen.
IMAPS-Europe strategies for Growth, Cooperation, Communication, Conferences & Symposia and for streamlining Internal matters were shortly outlined. But more time will be allocated at the next meeting in Cracow.
The pictures show the ELC members present at the meeting, a picture showing the seaside view from the conference site and finally one showing the lake and the conference site which can be seen above the lifebelt.
SN
UK:
Meetings Programme:
· MicroTech 2002 - 29 and 30 January 2002
Location: Manchester - Crowne Plaza (The Midland) Hotel. The IMAPS-UK flagship meeting will be held in Manchester. The two-day event offering two parallel sessions will focus in Session 1 on Materials for Electronics. Topics will include ceramics, passive components, polymers, adhesives, lead free solders and consideration of environmental issues. Session 2, Advances in Microtechnologies will discuss MEMS, chip scale packaging and reliability. A tabletop exhibition will provide delegates the opportunity to view and discuss latest products and materials from leading manufacturers and suppliers.
Further information on MicroTech 2002 is available from:
The Secretariat IMAPS-UK, 4 The Close, Bracebridge Heath, Lincoln LN4 2PB
Tel: +44 (0) 1522 575212 or Fax: +44 (0) 1522 575582
E-mail: office@imaps.org.uk
www.imaps.org.uk/_events/events.html
• Microelectronics and Packaging for Industry - Spring 2002
Date and location to be announced.
This one-day meeting will be held at the invitation of the Scottish Enterprise Board and is planned to cover a range of topics including HDI, Photonics and MEMS Packaging, Ceramics, Materials and Thick/Thin film Applications.
• Advanced Manufacturing - September 2002
Location - Kingston University.
This joint one-day meeting with the SMART group will cover many aspects and implications of advanced manufacturing techniques available to industry. Details to be announced.
• Automotive Technology and Applications - Autumn 2002
Location to be announced.
This one-day meeting will bring delegates up-to-date with the latest applications and technologies employed in the highly competitive automotive industry.
News from the Chapter:
• New website
Please visit the new completely revised IMAPS-UK website:
www.imaps.org.uk/welcome.html
France:
Meetings Programme:
• “Microélectronique en Provence Alpes Côte d’Azur,” January 24th, 2002
In a different region each year and after Lille in 2000, the regional day will be entitled “Microélectronique en Provence Alpes Côte d’Azur.” It will be held, January 24th, 2002, on the technopole Sophia Antipolis near Nice. As every year, the meeting will involve technical conferences in the morning and, in the afternoon, the visit of some local high-tech companies.
• 12th “Forum de la Microélectronique”
The 12th “Forum de la Microélectronique” will be, for IMAPS France, a special event, as it will undergo a double changing of date and location. Usually held in the beginning of spring in Paris, the next issue will take place, from the 3rd to the 5th of June 2002, in the “Palais des Congrés” of Versailles, in the close vicinity of the prestigious Chateau.
As usual the Forum will involve technical conferences and an exhibition with around fifty exhibitors.
Besides the main technical programme, specialised workshops will be dedicated to European efforts for supporting the R&D in microelectronics, packaging and Mems technologies.
As every year, the 12th Forum will be the occasion for awarding the best works, for frenches students, in the field of microelectronics packaging. A first prize of Î1500 and two second prizes, Î1000 each, will be allocated.
Although being, first, a national event, our Forum is open to foreign participants; European and other international attendees are welcome as speakers, exhibitors or visitors.
See you in Versailles in June!
News from the Chapter:
After the organisation of IMAPS Europe 2001 in Strasbourg, IMAPS France will find again a more traditional way.
For the year 2002, the principal events will be the “Journée Technique Régionale” (Regional Technical Day) and the annual “Forum de la Microélectronique.”
Jean-Paul Droguet, IMAPS France Board, A.M. Correspondent
More information? On IMAPS France? Events? Membership? Please contact:
Florence Vireton, Secrétariat IMAPS-France, 49 rue Lamartine - 78 035 VERSAILLES cedex
Tel.: +33 1 39 67 17 73 - Fax: +33 1 39 02 71 93
E-mail : IMAPS.FRANCE@wanadoo.fr
http://perso.wanadoo.fr/imaps.france/
Nordic:
Meetings Programme:
• 39th annual Conference 2002
The 39th conference will take place in Stockholm, September 29-October 2, 2002
Please find the Call for papers - or other general info - at www.imapsnordic.org
Business Trade/Industry News:
• IMEGO, Sweden
Imego applies microelectronics, micromechanics, and new components in microsystems. Imego’s business philosophy is to produce demonstrators, prototypes, and products together with, and on behalf of, companies and researchers. The activities are directed toward generating profitability for their customers and themselves. Examples of key components are sensors, microwave components, quantum components and components based on new materials. Imego works for establishing long-term relationships with business partners and customers, and to be a total solutions provider for them. The most pronounced strength of Imego is a unique cross-disciplinary competence that enable them to take total responsibility for microsystems product development, from idea to production, including sensor design, electronics, signal processing, packaging and industrial design.
The Imego Institute was founded by the Swedish government in 1999 with a starting capital of 10$M for investments and a guaranteed minimum annual research founding of 2$M, during the first 5 year period. The government intention with Imego is to create a modern business orientated research organization that is attractive for both companies and universities to cooperate with. After the initial build up period, 70% of the turnover is expected to come from direct industry assignments, and the remaining 30% from a base founding, national and EU research contracts. Since January, 1999, the organization has developed rapidly and today more than 50 persons are involved in Imego R&D projects aiming for customer application specific sensorsystems. Presently their two largest industry contracts are in the area of inertial navigation system. In one Imego is acting as a total solutions provider and deliver a complete system including software, industrial design, etc. In the other they develop a new high-end gyro for a system manufacture.
Corner stones in Imego’s strategy and business philosophy are: time, focus, independence and customer benefit. Imego aims to be efficient and provide the fastest possible route to production by utilizing existing infrastructure through their large international network of subcontractors. They focus on micro sensorsystems with emphasis on systems, but within this niche they are broad. Working with optical, micromechanical, magnetic, electromechanical, bio and chemical sensors. Imego does not own manufacturing equipment, which give them a technological independence. This combined with their broad sensor competences enables them to provide and recommend to their customers the most suitable solution for his application independent of manufacturing technology. Further, they are always considering the business case for a project to ensure that the effort spent shall be of economical benefit for customers and Imego.
Imego is ISO 9001/2000 certified, approximately 50% of the employees are PhDs and 25% have more than 10 years of relevant industrial experience. Imego works actively with intellectual properties right and have more than 20 patents/pending patents.
An example of a patented technology from Imego will be described in a technical paper brought in this issue of AM. The paper was originally presented at IMAPS-Nordic in Oslo, September, 2001.
• Ceramic Technology Advances in Oulu, Finland
Ceramic technology, especially LTCC, is growing very fast in applications, where high reliability and performance are required. Due to good high frequency properties and high packaging density based on multilayer structures and possibility to integrate passive components inside the substrate, LTCC technology is gaining ground also in telecommunication products.
LTCC technology has been studied and developed at University of Oulu in the Microelectronics laboratory for more than 5 years as a part of the national research program (ETX) “New integrated substrates” and as a Tekes-project “3-Dimensional Telecommunication Components with LTCC Technology.” The Microelectronics laboratory has a long experience in thick film technology and material research. The goal is to build a leading center of expertise of LTCC-modules, to study, develop, manufacture and test RF-modules using the latest design and test procedures, materials and manufacturing methods.
A national project INKEMO (Integrated Ceramic Micromodules) is a 4-year-project carried out to develop LTCC-technology especially for future RF-modules. The topics of the research include ceramic LTCC materials and their processing, interconnection technologies, manufacturing of test modules; electrical modelling and measurements of LTCC structures; precision printing by gravure methods; and reliability testing and thermomechanical modelling focused on LTCC technology. The project participants are ADC Telecommunications Oyj, Aspocomp Group Oyj, JOT Automation Oyj, Nokia Networks Oy and Selmic Oy with financial support from Tekes, the National Technology Agency.
Development of a laboratory scale fast prototype LTCC process line was accomplished. Special methods to control the quality of the whole process during the production were also developed. Especially the optical positioning system, using of laser and the actions of quality assurance assured components with designed electrical functions. The process was used to realise several base station components for mobile telecommunication purposes. The electrical function of 3-dimensional components (Fig. 1b) was computer-aided modelled and simulated (Fig. 1a) and predicted well the actual measured performance (Fig. 1a).
New gravure printing methods were developed and tested. With a new Resist Gravure Printing (RGP) method one can print very narrow and high conductive lines like 25 mm narrow lines with fired thickness of 20 mm. The achieved first year results indicate the possibility to reach totally new art of ultra fine-line printing process suitable also for mass production.
VTT Electronics (Technical Research Centre of Finland) has focused its packaging research on multilayer ceramic technologies. The LTCC manufacturing line operates for development purposes and prototyping services for the industry in Finland and other countries. The applications include telecommunication, optoelectronics and MEMs packaging.
A national project CERMOD (Ceramic technology for the future RF-modules), focused on LTCC technology, is going on at VTT until May, 2002. The high frequency properties of different LTCC material systems are characterized. Physical models and simulation methods for integrated passive components are developed.
Fine-line conductor processing on LTCC substrates is developed with a goal for higher packaging density and improved high frequency performance. Photosensitive thick film materials from Du Pont and Heraeus are evaluated with a focus on co-fireable silver conductors and process optimisation for these. The processing of etchable surface conductors and stencil printed lines is also developed. The conductor line properties, dimensional repeatability and material compatibility are evaluated. The high frequency properties are characterized up to 40 GHz. Further information about VTT Electronics is available at www.ele.vtt.fi.
Both of these projects are also part of the NCEM-program (Northern Center of Electronics Manufacturing). NCEM is an umbrella coalition for several development programs to develop electronics production especially in the fields of life-cycle testability, future connection and packaging technologies, future manufacturing platforms and integration of design and manufacturing. For more information, see http://www.elsi.net/ncem. Authors: Terho Kutilainen, chairman of CII Europe, Aspocomp Group Oyj, professor Jouko V‰h‰kangas, steering group member of CII Europe, University of Oulu and Kari Kautio, VTT Electronics.
Germany:
Meetings Programme:
• IMAPS-Seminar Göppingen, 14.02.2002
Construction and interconnection techniques for high integration —One for all?
Welcome address: Heinz Osterwinter, IMAPS-Germany
European Thin Film Technology: Ernst Feurer, Reinhardt Microtech GmbH, Ulm
Possibilities and limits in modern HDI Technologies: Walter Schmidt, HDIC GmbH, Russikon/CH
Requirements for LTCC systems at frequencies beyond 10GHz: Andreas Möller, Robert Bosch GmbH, Reutlingen
Modular technologies for RF Digital Radio Links and LMDS applications —Status and trends: Dr. Martin Oppermann, EADS Deutschland GmbH, Ulm
LTCC as material system for microwave applications: Reinhard Kulke, IMST GmbH, Kamp-Lintfort
Possibilities with passive integration in LTCC: Dr. Jens Müller, MSE GmbH, Berg
Photoformed co-fired conductors in LTCC: Erich K. Polzer, DuPont de Nemours Deutschland GmbH, Bad Homburg
KQ thickfilm paste as alternative to thin film lines: Michael Feil, FHG-IZM München
Manufactire and design rules of HDI circuits: Birgit Straub, Multek Germany, Böblingen
SIMOV-PCB building blocks: Eberhard Tadic, INBOARD Leiterplattentechnologie GmbH, Karlsruhe
Closing remarks: Heinz Osterwinter, IMAPS-Germany
The language at the seminar is German.
Please find more details at www.imaps.de
• 14th EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION
Friedrichshafen / Germany, June 23-25, 2003
The Call for Papers is out: The Technical Program Committee of EMPC 2003 invites abstracts of unpublished work describing recent developments in Microelectronics and Packaging.
Topics include, but are not limited to:
- Materials & Technologies (Thick/Thin film, LTCC, Advanced PCBs, MCMs, FlipChip, CSP, COB, SMT)
- Design & Modelling (DFM, thermal/electrical/mechanical simulations, CAD-tools)
- Manufacturing & Processes (HDI-Processing, Large Area Processing)
- Applications (RF/Microwave, Power Packaging, Automotive, Avionics, Advanced Packages, Medical)
- Quality & Reliability (Test and Inspection techniques, 1st/2nd level package reliability, qualification standards)
- Environment (Green materials, Lead free products, Product Recycling, Waste Recycling)
For any further information, please contact EMPC 2003.
c/o AKM Congress Service GmbH, Hauptstrasse 18, D-79576 Weil am Rhein / Germany
Phone: +49 7621 98 33 33; Fax: +49 7621 78 714
Please visit the website: www .empc2003.de
Poland:
Meetings Programme:
• European Microelectronics Interconnection and Packaging Symposium,
IMAPS-EUROPE CRACOW 2002 - June 16 —18th, 2002
Venue: HOTEL SOFITEL, CRACOW, POLAND
IMAPS-Europe Cracow 2002 is one of the most outstanding European conferences, providing an international forum for the presentation and discussion of recent developments and future trends in the field of microelectronic materials, packaging and interconnection.
The Symposium will include a TABLE TOP EXHIBITION.
At the beginning of the 1990s, Poland underwent major economic change. Many inefficient state enterprises and factories went bankrupt. The electronic industry suffered, too. However, the situation soon improved thanks to foreign investment and the rapid growth of the small and medium enterprise sector. PCB, SMT, thick and thin film hybrids, sensors for non-electric values, electronics for medicine and electronic devices controlling manufacturing processes, have been most successful. Today, the Polish electronic industry is concentrated in the Cracow region.
Cracow, the most beautiful Polish city with one of the oldest universities in Europe, lies on the banks of the Vistula river in the southern region of Poland. Its focal point is the Market Square situated at the heart of the Old Town - the city’s historic centre. This compact area is a treasure-trove of architectural monuments, given recognition in 1978 when it was included on UNESCO’s World Heritage List. To the south of the Market Square, perched on a hill, is the magnificent Wawel Castle, the seat of Poland’s kings until the late 16th century. Cracow is a major tourist destination, each year playing host to numerous cultural events and festivals. In 2000 it was chosen as one of the European Capitals of Culture for the millennium year.
There are direct flights to Cracow from many European cities, as well as from New York and Chicago. Alternatively, one can fly to Warsaw and then continue to Cracow on LOT Polish Airlines’ domestic service (six per day, 40 minute flight time) or by train (2 hours 30 minutes).
Please visit the web site for more info: www.itme.edu.pl/imaps.cracow2002 /index.html
• 26th IMAPS-Poland Conference, Warsaw 25 — 27th September 2002
The 26th IMAPS-Poland Conference will be held in Warsaw 25 — 27th September 2002. It is oraganised by Institute of Electronic Materials Technol-ogy (ITME) and Technical University of Warsaw. Further information about the Conference is available from Dr Magor-zata Jakubowska Institute of Electronic Materials Technology, Warsaw. Fax: ++48 22 834 9003,
e-mail: maljakub@sp.itme.edu.pl
News from the Chapter:
• IMAPS-POLAND 25th CONFERENCE
The 25th ISHM-Poland Conference was held in Polaczyk in the beautiful mountain resort, 26-29 September 2001. It was organised by the Technical University of Rzeszow sponsored by the Polish Research Committee. Over eighty participants from Poland, Japan, Romania, Slovenia, France and Ukraine attended the Conference. Invited papers and over sixty posters were presented covering the following topics:
- physics and semiconductors materials
- technologies
- sensors
- materials
- thermal effects
- passive components
- circuits
The Workshop on High Density Packaging followed the Conference.
• New board
The General Assembly of IMAPS Poland gathered on 28th of September, 2001.
The results of the election of the new Executive Board and the Board of Directors of IMAPS Poland for 2001-2003 were announced.
The Executive Board
The President
Prof. Leszek Golonka
The President Elect
Dr Andrzej Dziedzic
Vice-President
Mr. Michal Ciez
Treasurer
Dr Barbara Dziurdzia
Secretary
Dr Malgorzata Jakubowska
The Board of Directors
The Chairman
Prof. Stanislaw Nowak
Members
Prof. Wlodzimierz Kalita
Prof. Jan Felba
The General Assembly authorised Dr Selim Achmatowicz to represent IMAPS Poland at ELC.
Czech & Slovak:
News from the Chapter:
The IMAPS Czech and Slovak 8th Annual Conference, was held in Brno on October 24, 2001, together with SMT info seminar. Over eighty partecipants from the Czech Republic and other countries attended the conference. Soldering and Cleaning in Electronics and New Trends in Interconnection and Packaging were the main topics of this conference. In addition there was a tabletop exhibition.
Next year’s conference will take place September 22-23, 2002.
Business Trade/Industry News:
Flextronics strarted the industry activity in Brno town, which has recieved about 30,000 sqm for the symbolic price 1 Kc. The new plant for 3,000 employees is starting production of SMT equipments.
Czech Trade: The first time after political changes in year 1989 the Czech trade reached the positive balance, when export of Czech goods exceeded imports in the Czech Republic.
Ivan Szendiuch
Hungary:
Meetings Programme:
(a possibility to combine your European tour to the IMAPS Cracow with this IEEE conference in Hungary)
• Second International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Hotel Balaton, Zalaegerszeg, Hungary, June 23 - 26, 2002
Call for Papers
The deadline for abstracts is Feb 28, 2002. Please email it to polytronic.2002@ett.bme.hu or fax it to number +36 1 463-4118. For more details, please check www.ett.bme.hu/polytronic2002
Message and Invitation from the Conference Chair:
Please again check the conference homepage www.ett.bme.hu/polytronic 2002 for the planned exhibit programme, social activities, exhibition etc.
On behalf of the Organizing Committee and myself, I look forward to welcoming you at the 2nd International IEEE Conference Polytronic 2002.
Zsolt Illyefalvi-Vitéz, Conference Chair
Israel:
Meetings Programme:
• IMAPS - Israel bi-annual International Symposium, June 13, 2002
The IMAPS - Isreal management team has decided that the IMAPS-Israel bi-annual International Symposium will be held in the Daniel hotel located in Herzeliya On Sea on June 13, 2002.
This date has been decided based on the scheduling reasoning used successfully for the previous two symposiums in years 1998 and 2000 - to hold the symposium basically during the week before the European Annual Symposium and thus most or all foreign visitors - especially overseas presenters who can combine these two events within practically on week of travel abroad.
Russia:
News from the Chapter:
• Official approval by ELC
At the recent ELC meeting 10.11.01 in Friedrichshafen (the venue for the 2003 European Microelectronics Conference) IMAPS-Russia was formally accepted and welcomed.
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