New Products
SEMI DICE to Sell Motorola Product
Semi Dice is now authorized to sell selected Motorola semiconductor products in bare die form through a trial supply program with Motorola. This initiative allows Semi Dice to develop selective die sales programs with Motorola. Semi Dice has been a distributor of Motorola active die components since 1980. Motorola discontinued its bare die product in the late 1990s. Motorola’s new supply program with Semi Dice is part of the company’s initiative to re-enter this portion of the microelectronics industry.
For more information, please call 1-800-345-6633.
EMERSON & CUMING Offers High-Speed Dispense Surface Mount Adhesive in Fluorescent Red Paste Form
Emerson & Cuming now offers its high-speed dispense, epoxy surface mount adhesive for bonding electrical/electronic components in fluorescent red paste form. Emerson & Cuming E 6752 adhesive bonds a wide range of components including chip capacitors and resistors, SOTs, SOICs and PLCCs at speeds up to 50,000 DPH. Designed specifically for use in high-speed pneumatic and positive displacement dispensers, the one-component adhesive cures in 3 to 5 minutes at 120°C in a standard convection oven and prevents component movement during board handling and cure. Its low shrinkage during cure and low coefficient of thermal expansion minimizes stress on bonded components.
For more information, please call 978-436-9700.
KYOCERA Introduces Next Generation Flip Chip Build-Up Packages
Kyocera has introduced the next generation organic substrate for flip chip semiconductor packaging, S-HDBU(R) (Super High-Density Build Up). This advancement allows superior signal routing of full array I/Os at flip chip bump pitch down to 180um with a roadmap to 150um pitch capability. Most build-up technologies available for flip chip packaging today are based on a laminate core technology using mechanically drilled through vias at 500 to 600um pitch, which makes routing of high signal count devices difficult.
For more information, please call 1-800-468-2957.
PALOMAR Integrates In-Line System Fully Automated Optoelectronic Assembly†
Palomar Technologies has designed and integrated a complete automated line for the production of optoelectronic packages. Depending on the package design and requirements, the line integrates Palomarís wire bonders and Palomarís brand new In-Situ UV Component Assembly Cell, which avoids problems inherent with “snap cure” methods such as out gassing, very small batch sizes, and short work times. The “hands-free,” recipe-driven process assembles the components in the package and performs the first-level interconnect necessary to provide the componentís electrical connection to the outside world. The line is integrated with a high-volume fluid dispenser, reflow oven, plasma cleaner, and inspection machines, with automatic handling between process stations.
For more information, please call 760-931-3600.
EnduraTEC
New TestBench™ Series
EnduraTEC has introduced its TestBench™ Series that was designed with component testing in mind. Now the test engineer can assemble different configurations using ìbolt togetherî modular motors, actuators, and base assemblies. The TestBench™ is ideal for testing automotive, microelectronics, and consumer product components.
New WinTest® PCI Digital Control Series
The PCI Series Electronics is the latest version of the EnduraTEC digital control hardware. The power and flexibility of the WinTest® software and hardware provide an array of control capabilities for single and multi-channel systems and can handle up to 8 independent test stations of control and up to 64 channels of data acquisition.
For more information, please call 612-933-7742.
New Series of Luxprint® Electroluminescent Materials from DUPONT
The new 8100 series Luxprint® thick film materials for electroluminescent lighting uses new advances in phosphor binder chemistry to produce brighter, more long-lasting lamps than previous EL systems. EL lamps using Luxprint® thick film materials are thin, flexible, lightweight, have a low power draw and produce very little heat. They offer uniform surface illumination, excellent vibration resistance, low maintenance, no burnout and are easy to install.
For more information, please call 302-999-2270.
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