Is This a Sign of the Future for Microelectronic Packaging?
The other day while I was looking up some technical data on the Internet, I decided to see what was happening in Microelectronic Packaging. I was using the MSM search module (used to find a web site) and entered Microelectronic Packaging and started a search. I came across a couple of interesting references. Could these indicate the future of Microelectronic Packaging in the 21st Century?
The first was:
Purchase your Chip Scale Packaging: Design Materials, Processes and Reliability at Walmart.com
The chip you need in a package you want, at Wal-Mart’s low prices? Is this the purchasing agent’s dream? The Design Material, Processes and resulting Reliability of the Chip Scale Packaging you need at Wal-Mart today. Things have certainly progressed over the last few years.
The second was:
Purchase your Advanced Electronic Packaging: With emphasis on Multichip Modules at Walmart.com
Multichip Modules have come a long way since IMAPS (ISHM and IEPS) started the International Conference on Multichip Modules in Denver. Who would have thought that things would have progressed so far since March, 1992? The integration of microelectronic packaging into our everyday life has certainly exceeded any ideas I had when I joined Rene Cote, John Balde and R. Wayne Johnson for that First Multichip Module conference.
I immediately rushed to their web page to view all the offerings at Wal-Mart. They must have the materials, designs, and hardware needed to solve my problem. This was bliss. The solution to my problems and a reliable source were at hand. It was obvious that my data search was for naught. I need only go to Wal-Mart for that smiley face, working on the ‘roll-back’ price and supply chain I needed for Agilent’s next product. Alas, it was not to be. There is a lot more work to do before Wal-Mart becomes Agilent’s Microelectronic Packaging Store.
A Wal-Mart Microelectronic Packaging Store may not be our future but it is clearly the present for many of the consumer products Microelectronic Packaging supports. The pace of Technology advancement continues to accelerate at a faster pace each year. The rapid pace of knowledge in all areas of our lives also continues to accelerate. The advent of microelectronics from the first silicon transistor, to the integrated circuit, to algorithmic state machines, to computers, to super computers, has allowed us to understand so much more about ourselves and our world. This accelerated rate of understanding will continue for the foreseeable future. The changes in our lives over the next ten years will astound those just joining the microelectronic industry as the last ten years has astounded those of us who helped develop it.
The Microelectronics Gold Rush at the IMAPS 35th International Symposium on Microelectronics is your opportunity to learn about the latest in Microelectronic Packaging. If you are new to Microelectronic Packaging or want to expand your technical knowledge in this fast paced area, there will be 17 courses offering you the latest in carrier technologies, assembly processes, failure analysis, advanced materials and RF/microwave packaging. The IMAPS Denver Technical program is outstanding. The record number of abstract submissions this year led to 25 Technical Sessions spanning 2 days of the conference. There will be five concurrent sessions each day. We also had a number of great papers that didn’t fit into a particular session so a poster paper session will be held on Thursday afternoon September 5th. The amount of new information will fill a book, a book we will happily give you. Learn about leading edge advancements, new materials, new equipment and process improvements that are being used to solve current problems, and provide solutions for many new challenges. Discover the latest in Process Control, new materials and leading edge Manufacturing techniques to realize those new challenges. Mine Denver 2002 Technical Program and Exhibition for solutions you may need for future products. Don’t miss the latest microelectronic packaging developments you and your company are going to need.
The Awards Ceremony will honor many of the IMAPS members and IMAPS Corporate Members who contributed so much to the Society over many years. We invite and encourage everyone to attend this special recognition ceremony on Wednesday September 4th. We owe many of these individuals and companies a great deal of thanks for their contributions to the Microelectronics Packaging and System Industries. This is our chance as a Society and as individuals to say “Thanks.”
Most of all, I send this ‘special invitation’ to you to Mine Denver 2002 and Network with Microelectronic Packaging Professionals from around the world. Take the time to dialog with colleagues who are working with these technologies in many industries. Professionals from Automotive, Optoelectronics, High Frequency, Microwave, Medical, Security and many more industries will be attending and presenting their latest work. To start the Welcome Reception IMAPS will provide a pleasant location where you can meet old friends, and talk with colleagues from around the world in an atmosphere conducive to relaxation and conversation. Ask questions about the latest developments at the Technical Sessions. Individually interface with the authors and developers about new materials, new equipment and new processes that are key to your business future products. IMAPS will provide many social functions that allow you to interface with the industry’s leading Microelectronic Packaging Professionals.
Review the rest of Advancing Microelectronics IMAPS 2002 Show Issue carefully for your areas of interest. Learn more about the Technical Session, Professional Development Courses and Things to do in Colorado. Also take advantage of the Sidney J. Stein Educational Foundation Golf Tournament and Silent Auction. Opportunities for Sponsorship of show events, the Golf Tournament, and the Spouse/Guest Program are included. Don’t forget to check out the web site devoted specifically to the show: www.imaps2002.org for the latest information. Join us for the Microelectronics Gold Rush and Mine Denver 2002; the paymaster will visit you often throughout the next year.
This issue of Advancing Microelectronics highlights our focus areas in Automotive and Photonics. The automotive paper is Comparison of Mechanical Reliability of Three Underfill Materials for Flip Chip Bumped on High Tg PCB HDI for Automotive Applications and the Photonic paper is Outgassing Species.
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