IMAPS Topical Workshop on Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS)
Hotel Bethlehem, Bethlehem, Pennsylvania
October 8-11, 2002
Sponsored by IMAPS and the Local IMAPS Keystone Chapter
General Chair:
Thomas Green, National Training Center for Microelectronics
Tel: 610-861-4128; E-mail: tgreen@northampton.edu
Technical Chair:
Rajeshuni Ramesham, Jet Propulsion Laboratory, California Institute of Technology
Tel: 818-354-7190; E-mail: Rajeshuni.Ramesham@jpl.nasa.gov
Vendor Chair:
Dao Phan, CVI Laser
Tel :610-395-7879; E-mail: allentown-sales@cvilasercorp.com
Tuesday, October 8
Registration: 7:30 am – 8:30 pm
Professional Development Courses: 8:30 am – 12:20 pm
PDC 1:
Overview of Optical-fiber Communication and Components
Instructor: William R. Heffner, Agere Systems Inc.
Description:
The objective of this course is to provide an overview of fiber-optic communications and the optoelectronic components that enable its capability. The course is designed for the technical professional, with or without experience in optoelectronics, who wants to see how all of the pieces fit together. The course will cover basic principles of the fiber optic transmission systems interwoven with the story of the evolving list of devices (components) and technologies that continue to expand the fiber’s capacity for carrying data.
The course begins with a discussion of the information explosion and the unique capabilities of the fiber in its transmission. We examine the issues of attenuation and dispersion and illustrate the significance that the light source plays in determining both distance and bandwidth. From here we trace the evolution of optical fiber systems from the single wavelength, point to point systems of the 80s through the DWDM systems of the 90s to today’s focus on wavelength routing.
Components are introduced within the context of this discussion showing how greater system performance is directly linked to the unique advantages that each new device contributes. Discussions will focus primarily on the active components which include lasers, modulators (external and integrated), integrated tunable sources, fiber amplifiers (EDFA and Raman) and optical MEMS for add drop and other functions.
Who Should Attend?
This PDC is intended as an introductory level course for any engineer or technical professional working in the IC or opto process or packaging field who would like to have a better understanding of what all those OE devices are about and why others are so excited about them.
Instructor Bio:
Bill is a distinguished member of technical staff at Agere Systems (formerly Lucent Technologies) where he has worked for the past 24 years in electro-optic device technology, ranging from basic research in liquid crystals device technology to manufacturing and development positions in InP based semiconductor lasers and detectors. He is an active member of both OSA and IMAPS having served as opto packaging chair at several recent conferences. Bill also teaches as an adjunct member of the engineering faculty at Penn State University (GV) where he offers courses on laser and OE device physics. His educational experience includes an MS in Chemical Physics from Indiana University and a PhD in Physics from Stevens Institute of Technology. He has 15 publications and holds 6 patent in OE device related technology.
PDC 2:
Fiber Optic Communications/Devices
Instructor: W. Jeffrey Shakespeare, T-Networks Inc.
Description:
This course is designed to help opto manufacturers and design engineers investigate the promise of using fiber optic components in their products in order to improve the transmission and communications signal. A brief history and background of optical communications will be discussed to provide a framework and to help evaluate and understand the various types of active and passive components along with their applications. A special emphasis will be placed on:
- Fiber design and manufacture
- Basics of loss and fiber structure
- Types of fiber used in optoelectronic communications
- Equipment and processes used in fiber drawing
Active Components
- LED
- Laser
- PIN/APD
- Modulators
- Amplifiers
Passive Components
- Isolators polarization insensitive, polarization dependent
- Wdm, Tap, filter, splitter, circulator
- Filter based devices
- Fused fiber devices
- Fiber grating devices
- PLCs
Who Should Attend?
This PDC is a must for process engineers, designers and manufacturing engineers in the optoelectronics community looking to broaden their understanding of the various optoelectronics components that are the building blocks for the next generation optical networks.
Instructor Bio:
Jeff Shakespeare holds a Ph.D. in mechanical engineering from Lehigh University and has over 23 years of experience in the areas of electronic packaging, microelectronics packaging, and optoelectronics. He had been a Distinguished Member of technical Staff and Technical Manager at Lucent Technologies developing new packaging technology for fiberoptic lasers and holds several U.S. patents. He is currently packaging manager at T-Networks, an optoelectronics start up company in Allentown, PA. Jeff has extensive experience leading both R&D and Manufacturing, having spent much of his career developing and introducing new products to manufacture, including fiberoptic transmitters, receivers and amplifies as well as data modems, rack mounted digital equipment service units, and business telephones.
PDC Luncheon:
12:20 pm – 1:20 pm
Opening Remarks:
1:20 pm – 1:30 pm
General and Technical Chairs
Session 1:
Optoelectronics Overview Session
Session Chairs: Ron Petkie, Diamonex; Mike Cheney, Department of Defense
1:30 pm – 5:30 pm
An Overview of Optoelectronic(OE) Packaging
Rao V. Yelamarty, Agere Systems Inc.
OE Optical Design Concepts
Curtis A. Jack, Agere Systems, Inc.
BREAK: 2:30 pm – 3:00 pm
What is the Future for Technology Roadmaps on Optoelectronics Packaging?
Herbert Bennett, NIST
OIDA’s Initiatives in Photonics Manufacturing
Fred Welsh, Optoelectronics Industry Development Association
BREAK: 4:00 pm – 4:15 pm
Packaging Approaches for Photonic Integrated Circuits
Dan Meerovich, Erik Reuter, Bill Mordarski, Hong Hao, ASIP Incorporated
Silicon-on-Insulator Mode and Pitch Converters for Optical Interconnection
Philip Keating, Eugene Fike, Mickey Frish, Confluent Photonics Corp.
Optoelectronic Packaging Using Passive Optical Coupling
Amaresh Mahapatra, Robert Mansfield, Linden Photonics, Inc.
Reception: 5:30 pm
Dinner: 6:30 pm
Keynote: 8:00 pm
Speaker: Dr. Ravindra A. Athale, Photonics Program Manager
Defense Advanced Research Projects Agency (DARPA)
Talk Title: Optoelectronics Programs at DARPA
Wednesday, October 9
Registration: 7:30 am – 5:30 pm
Session 2: Assembly and Automation
Session Chairs: Ben Velsher, Kyocera America; Guna Selvaduray, San Jose State University
8:30 am – Noon
High Speed Solderless Interconnect for use with Fiber Optic Transceivers
Robert Wagner, Hesham Elkhatib, Cinch Connectors, Inc.
Precision Automation Technology for the Assembly, Alignment and Bonding of Active and Passive Fiber Optic Components
Ernie Bancroft, Adept Technology, Inc.
Optoelectronic Packaging Concepts Using Active Polymer Systems
Leo M. Higgins III, Siemens Dematic EAS
BREAK: 10:00 am -10:30 am
Integrated Optoelectronic Component Manufacturing Techniques and Methodologies
Joseph S. Bell, Palomar Technologies, Inc.
Designing an Optoelectronic Package
Robert Irvin, Coviant
High-accuracy Eutectic Die Bonding Techniques for Optoelectronic Packaging
Daniel F. Crowley, MRSI, A Newport Corporation Company
Session 3: Materials for Optoelectronics
Session Chairs: Ray Pearson, Lehigh University; Carl Zweben, Zweben Consulting
1:30 pm – 5:20 pm
Aspects of CVD Diamond in High Performance Microelectronics
Ronald Petkie, Diamonex
Reliability Enhancements with AlSiC Composite Structures for Optoelectronics and Wireless Packaging
Dave Saums, Ceramics Process Systems Corporation
Low Temperature Co-fired Ceramic (LTCC) Packages for High Frequency and Optoelectronic Packaging Applications
Michael T. Lanagan, Dean Anderson, Amanda Baker, Clive Randall, Pennsylvania State University
Lead and Cadmium Free Acid Resistant Electronic Overglazes
Srinivasan Sridharan, Michail Moroz, Ferro Corporation
BREAK: 3:10 pm – 3:40 pm
High Speed Dielectric Materials for Optoelectronic Modules and Transponders
Gregg Wildes, C. P. Ganatra, W. L. Gore & Associates
Solder/Substrate Interactions in Optoelectronic Packaging
Michael R. Notis, Lehigh University
Alternative Solder Alloy Considerations for Optoelectronic Assembly
Brian O’Neill, David Suraski, AIM
Improvement of Interconnection Reliability for GC-SOA Chip by Incorporating Cu6Sn5-Containing Composite Solder
Jong-Hyun Lee, Yong-Sung Eom, Kwang-Seong Choi, Byung-Seok Choi, Jong-Tae Moon, Electronics and Telecommunications Research Institute (ETRI)
Reception: 5:30 pm
Dinner: 6:30 pm
Evening Activity: TBD
Thursday, October 10
Registration: 7:00 am – 7:00 pm
Exhibitor Setup: 8:00 am – 10:00 am
Exhibits Open: 10:00 am – 7:00 pm
Session 4: Reliability in Optoelectronics
Session Chairs: Ephraim Suhir, University of Illinois; Gene Fike, Confluent Photonics
8:00 am – 10:00 am
Accelerated Life Testing in Optoelectronics and its Interaction with Qualification Tests
E. Suhir, University of Illinois
“Smart” Photonics Package with a Tunable Liquid Microlens: Performance and Reliability
Tom Krupenkin, Shu Yang, Peter Mach, Bell Labs, Lucent Technologies
Highly Reliable Laser Modules for Undersea Applications
R. C. Schweizer, S. F. Tesarik, Agere Systems Inc.
Warpage Evaluation in Optoelectronic Devices
Arkady Voloshin, Lehigh University
Lunch in Exhibit Hall:
11:30 am – 1:30 pm
Professional Development Courses: 1:00 pm – 5:00 pm
PDC 3:
Predictive Modeling and Accelerated Life Testing in Photonics Packaging
Instructor: Ephraim Suhir, University of Illinois at Chicago, Iolon, Inc., and ERS Co.
Description:
The objective of this course is to describe the role and use of predictive modeling in photonics packaging engineering, as well as the role, attributes, challenges and pitfalls in accelerated life testing (ALT) of photonics structures and packages.
Accordingly, we address first the role and importance of predictive modeling in photonics package structures, and discuss its merits, shortcomings and interaction with experiment. Particularly, we indicate the importance of analytical (“mathematical”) modeling, and its interaction with numerical (primarily finit | 
