Message from the Technical Chair
We welcome you to join us in Denver, Colorado, for the 35th International Symposium on Microelectronics. This year's technical program brings together the very best in Professional Development Courses and Technical Sessions to provide you with the essential information needed to keep up with today's challenges in the design and packaging of electronic products.
To meet the challenge, the IMAPS 2002 technical program will deliver nearly 20 professional development courses and provide you with an opportunity to attend any of the 150 original papers being presented. In addition, there will be a discerning inter-national poster session comprised of 30 technical presentations to further enhance your knowledge and understanding.
Year after year, IMAPS delivers unmatched quality of papers and presentations from leading industry professionals. Not only will you find sessions dealing with hybrid microelectronics and SMT, but we also have the new and emerging topics covered such as: lead-free soldering, precision opto-electronic assembly and packaging, the state-of-the-art in MEMS technologies, wireless applications, high density interconnection, integrated passives and much, much more.
So, come and join us at the technical conference and exhibition in Denver. We've got a gold mine of information for you to sharpen your skills. Along with the exceptional technical program, take advantage of the networking opportunities and spend some quality time with your peers. We look forward to seeing you here in September!
Best regards,
Richard Charbonneau
