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Advancing Microelectronics • Volume 29, No. 4 • July/August, 2002
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Hello again to all Exhibitors

Do you want to enlarge your company’s image with leading engineers, management professionals, technicians, purchasers, suppliers, and marketers in the fields of photonics, optoelectronics, MEMS, sensors, wireless, wafer scale and more? You can accomplish this goal by joining the Gold Rush Race and Mine Microelectronics Gold in Denver IMAPS 2002. “Get Your Ass Over the Pass” (see last month’s article) and register for the IMAPS Symposium.

The annual IMAPS symposium is the industry’s premier information source. The conference and exhibits will be held in the Colorado Convention Center and the Adam’s Mark Hotel, September 3-7, 2002. This society of technology professionals is dedicated to sharing the latest information related to microelectronics and packaging.

As an exhibitor this is your chance to market your products to the international microelectronics industry. We expect a large attendance from companies in the Asian community this year.

New at IMAPS 2002 will be an On-line Product and Services Web Page for easy identification of your company’s expertise. For your customer’s convenience, this service will be available prior to and during IMAPS 2002.

The conference committee has been working diligently to bring in many expert presenters from around the world for this event. In fact, a near-record number of abstracts — more than 250, from nearly 30 countries of origin including the United States, is a testament to the truly international scope of the IMAPS symposium.

IMAPS 2002 offers an exceptionally robust technical program, bigger and better even than last year’s impressive turnout in Baltimore.

Presentation topics include automotive electronics, chip scale packaging, high density displays, medical electronics, military electronics, wireless, ceramic technology, microwave, polymer technology, reliability, and much more. Hundreds of exhibitors are also participating, and are ready to help you convert those pressing packaging and process questions into successful reality. Don’t miss this conference.

Plus, IMAPS 2002 includes the opportunity to attend 17 professional development courses for in-depth training on topics including wire bonding, embedded passives, flip chips, LTCC, thermal management, and more. Also planned, in conjunction, is the 4th Advanced Technology Workshop (ATW) on Packaging of MEMS and Related Micro Integrated Systems, at the Adam’s Mark Hotel, September 6-8, 2002.

You don’t have to be a member to participate in IMAPS 2002. Don’t delay — visit www.imaps.org/imaps2002 and click on ‘Reserve Booth’ to register for an exhibit booth.

Join us in September for this terrific event. See you in Denver!

Warner Andrews, Exhibits Co-Chair

   

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