HeraLock™ Zero Shrink LTCC Materials from HERAEUS/CMD
The HeraLock™ HL2000 zero shrink low temperature co-fired ceramic (LTCC) tape system incorporates proprietary (patent pending) zero shrink materials technology, providing a means to significantly increase the flexibility in using LTCC. HL2000 is unique in the ability to be processed in a standard LTCC firing process, producing product with X/Y shrinkage of less than 0.2% with 140 ppm tolerance. Applications include RF applications up to at least 5 GHz, integrated passive components, optical packaging, automotive modules and sensors, biomedical, and fuel cells.
For more information, please contact 610-825-6060.
SSEC Enhances Single Water Wet Etching
Solid State Equipment Corp. has improved performance and operational efficiency of its Trilennium™ single wafer etch processors with two new features. Endpoint direction makes the etch process more precise and with chemical blending systems can operate from internal sources of controlled chemistry, with onboard dilution.
For more information, please call 215-328-0700.
Upgrade Stencils to Next Revision by MICROSCREEN
MicroScreen LLC has the capability to add or revise apertures on existing stencils. A new revision to a p.c. board usually requires a new stencil. Now, the existing stencil can be sent to MicroScreen for the addition of the new or revised components, thus, eliminating the necessity of purchasing a new stencil.
For more information, please call 574-232-4637.
ITT Introduces Optical Connectivity for High-Bandwith Communications
ITT Industries, Cannon has announced the introduction of an innovative multi-channel optical interconnect system that overcomes the limitations of existing commercial fiber optic products. The new product, Cannon’s PHD™ system, is an advanced high density/high performance system for next-generation high bandwith communications equipment.
For more information, please call 714-557-4700.
New Line of Photochemically-Etched Electrical Contacts from PEI
Photofabrication Engineering, Inc., is now manufacturing a line of photochemically-etched electrical contacts made of beryllium copper for integrated circuit manufacturing.
These contacts are used in a wide range of applications, including pcb connectors, appliances, and lead frames for the automotive, aerospace, medical, electrical/electronic, and microwave industries.
For more information, please call 508-478-2025.
MRSI’s Multi-tool Head Enhances High Throughput
MRSI announces the availability of a new multi-tool head for automatic die bonding on the MRSI-375 Work Cell. This head allows the system to carry up to four or more collets simultaneously for higher throughput rates. Applications benefiting from this innovative feature include eutectic die bonding where a variety of components must be handled, including carriers, solder preforms, and assorted die sizes. The ability to carry all necessary collets available on the head allows for parallel processing, resulting in increased cycle rates. The MRSI-375 is a flexible automated work cell, used for a wide variety of dispense and assembly applications. The system is truly modular and individual units can be combined to meet virtually any throughput requirement.
For more information, please call 978-667-9449.
IMS Announces Availability of ULX-2512 Series Ultra Low Ohm Chip Resistors
International Manufacturing Services Inc. (IMS), a leading supplier of thick and thin film chip resistors and chip attenuators to the electronics manufacturing industry, announces that the ULX-2512 series of ultra-low ohm chip resistors are available in values ranging from 0.001 ohm to 0.1 ohms. Tolerances available are 5% (0.001 ohm to 0.005 ohms), 5% and 2% (0.005 ohms to 0.010 ohms), and 5%, 2%, 1% (0.010 ohms to 0.100 ohms).
For more information, please call 401-683-9700.
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