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Advancing Microelectronics • Volume 29, No. 2 • March/April, 2002
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European Activities & Calendar of Events:
EU programmes & activities:
NETPACK
“Network of excellence in microelectronic system integration technologies - packaging”, a thematic network project sponsored by the European Commission, opened its web site at www.netpack-europe.org with the following starting page:
“WELCOME on the “Netpack” information portal for the packaging technology community.
What is “Netpack”? “Netpack” aims at providing most up-to-date information in the field of microelectronic packaging. This portal will be structured into four “work packages”, each one dealing with a different aspect in technology, research and production.
- “Netpack” will offer a database about equipment and materials used in research and industry in the “packaging store”.
- “Education lab” aims at providing teaching materials and literature hints for students and teachers in the field of packaging.
- “Vision lab” deals with developments in the near and more distant future and will be a possibility to exchange ideas and perspectives
- “Netpack Club” will provide the possibility for networking and getting to know each other in the field.
This portal is meant to promote the packaging capabilities inside Europe and to foster the build up of a more independent industry. Four institutions (Technical University Berlin, ETH Zurich, Acreo Sweden and BME Hungary) from the European sphere are working together to make Netpack an attractive information source.
If you want to know more about the work packages, then just hit the buttons below. To become a member, fill out the membership form.
A working version of this website will be available from mid 2002.”
UK:
Meetings Programme:
- Advanced Manufacturing - September 2002
Location - Kingston University. This joint one-day meeting with the SMART group will cover many aspects and implications of advanced manufacturing techniques available to industry. Details to be announced.
- Automotive Technology and Applications - Autumn 2002
Location to be announced. This one-day meeting will bring delegates up-to-date with the latest applications and technologies employed in the highly competitive automotive industry.
Business Trade/Industry News:
IT’S KEEP YOUR HEAD TIME
“If you can keep your head when all about you are losing theirs and blaming it on you, yours is the world and all that’s in it and what is more you’ll be a man, my son.”
So ends the famous poem “If” by Rudyard Kipling. Keeping one’s head and indeed nerve is certainly the name of the game these days but is there just the tiniest whiff of an upturn? Maybe. Certainly there seems to be no let up in the start-ups that keep arriving: From the Southampton University opto nursery comes Mesophotonics which aims to put a buzz into the Photonics market by producing devices that are three to four orders of magnitude smaller and cheaper than conventional devices. An interesting initiative has been mounted by Enterprise Ireland to encourage entrepreneurs from both sides of the border to create start-up companies in the border towns. In Scotland there is a determined effort by the industry body Electronics Scotland to provide an infrastructure of skills, the supply chain and R&D over a five year period and is envisaging a need of some 5,000 engineers in the next 3 years. Not to be outdone the Welsh Development Agency has a project in hand costing £20M with a view to creating 50,000 high tech jobs there. Plenty of encouragement all round for those with start-up plans.
Welsh firm IQE that makes epitaxial wafers has announced a 15 month licensing agreement with Motorola to manufacture compound gallium arsenide-on-silicon wafers which will be financed by a share offer to the tune of £20M. The government also continues to support the industry with £60M to aid the creation of 12 manufacturing research centres based in academic institutions across the UK.
PCBs are certainly feeling the pinch with Viasystems and Celestica both making large redundancies whereas Sigtronics is planning to radically expand into high volume board production.
The semiconductor processing company BOC Edwards is to shed more than 100 of its 1500 workforce and distribution companies are predicting a 9% drop in component sales for them in 2002, a more cautious estimate from the 18% growth suggested for last year that turned out to be a 12% drop. It is times like these that people start thinking of other uses for products and the X-ray imaging technology developed for the better observation of PCBs might be adapted to detect bomb detonators in a more secure way so doubtless there will be many security companies expressing interest in this Keele University project.
Bluetooth gets recognition with the Cambridge Silicon Radio partner programme, which has 23 independent companies to provide product and services to accelerate development efforts and cut time-to-market for necessary products. Welwyn Components recently announced that its 18-month project to move its Hybrid facility at Bedlington to volume production is now complete. A lot has happened in the 100 years since Marconi sent his first radio message across the Atlantic.
As a final thought, can we assume that parking will be free in Brighton on cloudy days since the City Council has installed solar-powered pay-and-display terminals there?
B.C.W.
Italy:
Meetings Programme:
The “Continuing Education” activity is one of the most important and mandatory missions of IMAPS and pursuing this objective IMAPS Italy organises two 4-day technical meetings oriented to the microelectronic market reality and demands.
The events are the continuation of the successful series of technical courses held in Italy since 1998 to stimulate domestic educational activities and spreading know-how in rapidly changing areas, such as packaging, integrated passive components, SMTs state of the art in terms of processes, productivity, quality and testing.
This activity is concerning with research, development, design, manufacture and application of materials, devices and systems, focused in the form of workshops, tutorials or professional courses and the Teachers are specialists from different technological areas, from University and Industries.
In May 14th-15th and 29th-30th, the first of two 4-days courses, titled “Packaging Technology Solutions for Microwave & Optoelectronics” will be held in Milan, at DuPont Italiana, with the following program:
May 14th
9:00 Welcome, IMAPS Italy
9.15-10.45 “High Frequency” Products and Market Trend, G.Marzocchi, Multiservices
10.45-11.15 Blue Tooth: Standard and Application, D. Rossi, ST
11.15-11.30 Coffee break
11.30-13.00 Wireless Microwave Digital Transmission, M. Taverna, Siemens ICM
- Radio system main building blocks
- RF spectrum and channel arrangements
- Design topics and performance optimisation
13.00-14.30 Lunch
14.30-16.00 Microwave Technology in Modern Radio Systems, A.Giavarini, Siemens ICM
- Frequency generation
- Solid state power and low noise amplification
- Frequency conversion
- Selective networks (filters)
16.00-16.30 Coffee break
16:30-17.30 Propagation and Transmission Quality, M. Taverna, Siemens ICM
17.30 Closing
May 15th
9.00-10.30 Silicon Germanium for High Frequency RF applications, V. Giustino, IBM
10.30-11.45 Organic Packaging, S. Oggioni, IBM
11.45-12.00 Coffee break
12.00-13.00 Ceramic Packaging /MLC, S. Oggioni, IBM
13.00-14.30 Lunch
14.30-16.00 Ceramic Substrate, TBA, DuPont
- Thick Film Technology
- LTCC/HTCC
- Embedded passive
- Thick Film for High Frequency: an application, Nicotra, Mitel
16.00-16.15 Break
16.15-17.00 Ceramic Substrate, G. Carcano, Siemens ICM
17.00-17.30 PWB for High Frequency Application, F. Frisoni, Siemens ICM
17.30 Next Tutorial Introduction & Closing
May 29th
9.00-11.00 Packaging Technologies for RF modules, G. Carcano, Siemens ICM
11.00-11.15 Coffee break
11.15-12.15 Flip Chip Vs Wire Bonding, D. Conti, ST
- Electrical Performances
- Technological choices
12.15-13.00 Tools for Electrical Simulation and Designing (part I), G.Giannone, Microchip Italia; P.Galdini, Agilent
13.00-14.30 Lunch
14.30-15.30 Tools for Electrical Simulation and Designing (part II), G.Giannone, Microchip Italia; P.Galdini, Agilent
15.30-17.00 Tools for Thermal Simulation and Designing, L. Schnickel, Flowmerics
17.00 Closing, IMAPS Italy
May 30th
9.00-10.30 Optical Network Evolution, E. Iannone, Pirelli Labs
10.30-11.15 Active Optical Devices, M. De Donno, Pirelli Labs
10.15-11.30 Coffee break
11.30-12.15 WDM (Wavelength Division Multiplexing) Passive Optical Devices, A. Pianciola, Pirelli Labs
12.15-13.00 Optical Amplifier and Active Fibre, R. Corsini, Pirelli Labs
13.00-14.30 Lunch
14.30-15.45 Optoelectronics Technology Integration Trend, M. Gentili, Pirelli Labs
15.45-16.00 Coffee Break
16.00-17.15 Optoelectronics Packaging State of the Art, G. Del Rosso, Pirelli Labs
17.15-17.30 Next Tutorial Introduction & Closing
Following the demand for high frequency (Microwave & Optoelectronics) systems and products that have been growing at a rapid pace, the course will focalise the following aspects: market trend, high frequency basics, processing technologies suitable for microwave/optoelectronics hybrids, packaging using organic and ceramic technologies etc.
The course is designed for production Engineers or Engineer managers and for university students from scientific area who want to understand more about technologies and trends in rapidly changing areas of microelectronics.
The second 4-days course will be held in September 24th- 25th and October 8th-9th, and it will concern particularly the following: EMI, Testing and Technology Assurance. The specific programme will be informed.
For more information call IMAPS-Italian Chapter - Dr. L.Guizzetti (P.O. Box 210 - 27100 PAVIA – Italy
Tel. +39 0382 302859 - Fax +39 0382 27697 -E-Mail : pragmapv@tin.it) or visit the web site: www.imaps-italy.org
News from the Chapter:
Please visit the new web site: www.imaps-italy.org
Benelux:
News from the Chapter:
The IMAPS-Benelux autumn event “The road towards lead-free soldering” was held on November 16th at Philips CFT. Despite the difficult times faced by our companies and society, the one-day seminar was attended by 78 persons, clearly indicated the high interest in this subject.
In the evening, IMAPS-Benelux celebrated its 25th anniversary with an excellent dinner, bringing together present and past IMAPS-Benelux members in a joyful ambiance, so characteristic for the IMAPS organization.
Business Trade/Industry News:
New IMEC programme.
New IMEC program aims to integrate packaging with Cu/low-k interconnect October 16, 2001 – Leuven, Belgium --- IMEC has launched a program to integrate packaging and back end of line processes. The IMEC Industrial Affiliation Program (IIAP) called “Wafer-level packaging on Cu/low-k” will focus on issues related to the packaging of Cu-low k structures. The program is important to prepare for the future integration of the package as a within chip global interconnect provider. For more information, contact Laurence Gea, Email: Laurence.Gea@imec.be
Solar power.
Electrabel and TotalFinaElf join with IMEC to produce photovoltaic cells and modules. Electrabel, TotalFinaElf, IMEC and Soltech have set up the company Photovoltech for the production of photovoltaic cells and modules, which form the basic components for photovoltaic systems. In this venture, the energy companies Electrabel and TotalFinaElf are pooling their skills with those of IMEC, located in Leuven (Belgium). The stakes put up by the respective companies amount to 42.5% for Electrabel (including the Soltech stake), 42.5% for TotalFinaElf and 15% for IMEC. Photovoltech is to build a fabrication plant for photovoltaic cells and modules in Tienen (Belgium). The new production process developed by IMEC and granted in licence to Photovoltech will enable photovoltaic cells to be produced from polycrystalline silicon, at lower cost and with higher efficiency than by conventional technology.
Specialist companies such as Soltech will then incorporate the modules into application-specific photovoltaic systems that will supply electricity for the autonomous operation of telecommunication systems, weather stations, navigation buoys, road signs, electrification of houses and villages in developing countries, but also in grid connected systems integrated in residential and tertiary sector buildings.
Construction of the fabrication plant should take around 18 months, and production of photovoltaic cells is scheduled to begin around mid-2003. The Tienen plant will have an annual capacity of 2.5 to 3.8 million units (6 to 9 MW peak), representing more than 10% of the European production of solar cells, and will soon be employing more than 50 people.
The investment involved comes to around EUR 10 million. This project is in line with the vision of Electrabel and TotalFinaElf to support the application of new technologies and to follow an active policy of implementing renewable energy sources for the generation of electricity. In this way, the two companies aim to increase their presence in the field of solar power, already established, respectively, through Soltech and Total Energie.
Custom Silicon Configuration Services (CS2) -
Brussels, December 5, 2001- The Board and the Management of CS2 announces that the negotiations, started in August 2001, were successfully finalised. The Company stated that, after long negotiations, regularly delayed by economical, social and legal implications, a final financing agreement has been reached with Business 21 sa. Business 21 sa, a Luxemburg based investment company, has indeed subscribed a financing facility cum warrants of US$ 25 million issued by CS2 in accordance with the resolution of the EGM of September 25, 2001. The financing facility, with duration of 3 years, will bear a nominal interest rate of 7%. For every US$1.57 that is underwritten, 3 warrants will be granted. The exercise price of this warrant has been fixed at EUR 0.4, being equal to the average stock exchange quotation of the share during the period of 30 days preceding the date of the EGM. Each warrant incorporates the right to 1 new share of the Company. The successful finalisation of this financing transaction will allow the Company to finance the existing and expected short-term cash drains and development of the Company. Moreover the Company will then be in a position to overcome the downturn still affecting the semiconductor market and more in particular in the wireless communication segments. The Company is preparing itself for the anticipated recovery that is expected to start during the second half of 2002 to boost in a real upturn as from the beginning of 2003.
To be prepared for the expected upturn of the semiconductor market every department of the company has been restructured by retaining and reinforcing the core competencies. Today CS2 is ready for the future facing a new age having all ingredients to succeed in positioning CS2 as the European leading company in design, assembly and testing of semiconductors.
People.
On January 11th, Philip Pieters received his PhD from the university of Leuven “Design and realization of integrated passive components and networks in thin film multilayer technology for wireless applications.” This work was performed at IMEC, Leuven. Currently Philip Pieters is with CS2.
France:
Meetings Programme:
- 12th “Forum de la Microélectronique”
The 12th Forum organised by IMAPS France with, as partners, NEXUS, ADEMIS and the European R&D programmes PIDEA, EURIMUS, will be held at “Palais des Congrès de Versailles,” June 3-4-and 5, in the close vicinity of the prestigious Château.
The papers will be focused on:
- High density interconnection substrates (materials and processes: High Density PCB, thin and thick film substrates)
- Bare dice assembly (Hybrids, MCM, Chip on Board, smart cards, “SOP, SOC”)
- Specific technologies for Microwaves, Optoelectronics or Power Electronics
- 3 D Technologies
- Micro and Nano technologies (microsystems, sensors)
- Industrialisation and production equipment
- Quality, Reliability, Environmental behaviour
- Tour de France 2002 of the R&D in Universities. Poster Session.
As every year, the 12th Forum will be the occasion for awarding the best works, for French students, in the field of microelectronics packaging. A first prize of EUR 1500 and two second prizes, EUR 1000 each, will be allocated.
The French Laboratories of Universities or Engineer schools are invited to present their activities and the work of their students, in the fields of Microelectronics, Interconnection and Packaging.
At the end of the session, the «Prix Etudiant 2002» will award a student, for an original technological study performed in the frame of his study cycle.
For participation: send a 2 pages maximum abstract before April 30, 2002.
ASSOCIATED EVENTS
European Cooperation Pro- grammes PIDEA, EURIMUS.
Monday, June 3, will be dedicated to the presentation of the results in the programmes PIDEA (Packaging/Interconnection) and EURIMUS (Microsystems).
Laser applications in electronics
2 half days dedicated to the Laser applications in electronics will be chaired by Irepa Laser.
Business Convention
In parallel with the technical events, a business convention will offer to suppliers an opportunity of exchanging with end-users.
Although being, first, a national event, our Forum is open to foreign participants; European and other international attendees are welcome as speakers, exhibitors or visitors.
See you in Versailles in June!
News from the Chapter:
More information? On IMAPS France? Events? Membership? Please contact:
Florence Vireton, Secrétariat IMAPS-France, 49 rue Lamartine - 78 035 VERSAILLES cedex
Tel.: +33 1 39 67 17 73 - Fax: +33 1 39 02 71 93
E-mail : IMAPS.FRANCE@wanadoo.fr
New web: www.imapsfrance.org
Nordic:
Meetings Programme:
- 39th annual Conference 2002
The 39th conference will take place in Stockholm, September 29-October 2, 2002
The Call for Papers is out, inviting for papers for following topics:
- Microelectronics applications;
- Trends in telecommunications;
- Ceramics for future electronics;
- Unique materials, encapsulation, and underfills;
- Microvia, HDI laminates;
- CSP, flip chips, area array packages;
- Bare die, MCM and 3D packaging;
- Future electronics, strategies, and R&D;
- Reliability assessment;
- Advanced interconnect;
- Integrated passives and System in Package (SiP);
- System cost assessment;
- Pb and halogen free electronics;
- Assessing environmental impact;
- MEMS, MOEMS, opto, medical, harsh environment applications;
- High frequency packaging;
- Break-through achievements in the Nordic countries.
The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than 20 April. Speakers will be notified of paper acceptance by email by 31 May. The deadline for the final paper is 20 July.
The conference will this year be slightly changed from previous conferences. Still there will be excellent sessions of interest for the Nordic OEMs but as something new a special session for the important subcontractors with their “New Product Introduction” centers will be organised. The title of this special session is: “Introducing new technologies to the production floor.”
Furthermore a Workshop is planned titled: “Workshop on microelectronics R&D management” Monday, Sept 30. The plan is to have a panel of representatives from national R&D, financing institutes like NUTEK and TEKES, some top company R&D managers and EU representatives for the large Technology Funding Programmes. Discussing topics would include:
- Very short statistics of microelectronics and packaging R&D volumes in the Nordic countries, public and private
- Industry impact on guiding the R&D, big and small companies
- Level of innovation in different types of projects (long term guiding contra innovation)
- The role of Europe and the Nordic countries
- Global networking, R&D loosing boarders?
- Transfer of R&D results to production
- Actual programmes and how to join
Please find the Call for papers - or other general info - at www.imapsnordic.org
Germany:
Meetings Programme:
- 14th EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION
Friedrichshafen / Germany, June 23-25, 2003
The Call for Papers is out: The Technical Program Committee of EMPC 2003 invites abstracts of unpublished work describing recent developments in Microelectronics and Packaging.
Topics include, but are not limited to:
- Materials & Technologies (Thick/Thin film, LTCC, Advanced PCBs, MCMs, FlipChip, CSP, COB, SMT)
- Design & Modelling (DFM, thermal/electrical/mechanical simulations, CAD-tools)
- Manufacturing & Processes (HDI-Processing, Large Area Processing)
- Applications (RF/Microwave, Power Packaging, Automotive, Avionics, Advanced Packages, Medical)
- Quality & Reliability (Test and Inspection techniques, 1st/2nd level package reliability, qualification standards)
- Environment (Green materials, Lead free products, Product Recycling, Waste Recycling)
For any further information, please contact EMPC 2003.
c/o AKM Congress Service GmbH, Hauptstrasse 18, D-79576 Weil am Rhein / Germany
Phone: +49 7621 98 33 33; Fax: +49 7621 78 714
Please visit the website: www.empc2003.de
Poland:
Meetings Programme:
- European Microelectronics Interconnection and Packaging Symposium,
IMAPS-EUROPE CRACOW 2002 - June 16 – 18th
Venue: HOTEL SOFITEL, CRACOW, POLAND
IMAPSEurope Cracow 2002 is one of the most outstanding European conferences, providing an international forum for the presentation and discussion of recent developments and future trends in the field of microelectronic materials, packaging and interconnection.
The Symposium will include a TABLE TOP EXHIBITION.
At the beginning of 1990s, Poland underwent major economic change. Many inefficient state enterprises and factories went bankrupt. The electronic industry suffered, too. However, the situation soon improved thanks to foreign investment and the rapid growth of the small and medium enterprise sector. PCB, SMT, thick and thin film hybrids, sensors for non-electric values, electronic for medicine and electronic devices controlling manufacturing processes, have been most successful. Today, the Polish electronic industry is concentrated in the Cracow region.
Cracow, the most beautiful Polish city with one of the oldest universities in Europe, lies on the banks of the Vistula river in the southern region of Poland. Its focal point is the Market Square situated at the heart of the Old Town - the city’s historic centre. This compact area is a treasure-trove of architectural monuments, given recognition in 1978 when it was included on UNESCO’s World Heritage List. To the south of the Market Square, perched on a hill, is the magnificent Wawel Castle, the seat of Poland’s kings until the late 16th century. Cracow is a major tourist destination, each year playing host to numerous cultural events and festivals. In 2000 it was chosen as one of the European Capitals of Culture for the millennium year.
There are direct flights to Cracow from many European cities, as well as from New York and Chicago. Alternatively, one can fly to Warsaw and then continue to Cracow on LOT Polish Airlines’ domestic service (six per day, 40 minute flight time) or by train (2 hours 30 minutes).
Please visit the web site for more info: www.itme.edu.pl/imaps.cracow2002 /index.html
- 26th IMAPS-Poland Conference, Warsaw 25 –27th September
We have the pleasure to inform you that XXVI International Microelectronics and Packaging Conference IMAPS-Poland 2002 will be held in Warsaw on 25-27 September.
This year meeting is organized by the Technical University of Warsaw and Institute of Electronic Materials Technology with participation of the Polish Society of Sensor Technique (PTTS) and the Section of Microelectronics of Committee for Electronics and Telecommunication of Polish Academy of Science.
The Conference topics include:
- Hybrid and Semiconductor Technology
- Design Methods and Computer Simulations
- Electronics Materials and Components
- Microcircuits Applications
- Thick-Film and Thin-Film Sensors
- Packaging and PCB
- Quality and Reliability Evaluation
- Thermal Management
- Optoelectronics
- Education in Electronics
The Conference presentations will be made in the form of:
- Invited lectures
- Poster Sessions for presentation of contributed papers
- Exhibition of microelectronics circuits, materials, technology and measurement equipment
The Conference language is English.
You are cordially invited to participate in the Conference and to submit your paper. One-page abstract of your paper should be sent before 30 April. The deadline for full paper submission is 30 June. The accepted papers will be published in the Conference Proceedings.
All additional information concerning the Conference, you can find on our WEB pages, which are under preparation:
http://www.elka.pw.edu.pl/IMAPS-PL-2002
If you have any question please do not hesitate to contact us.
The address for correspondence:
Dr Ryszard Kisiel, Technical University of Warsaw, ul. Koszykowa 75, 00-662 Warszawa
Tel.: +48-22-6607852, Fax: +48-22- 628 87 40, E-mail: kisiel@imio.pw.edu.pl
or Dr Magorzata Jakubowska, Institute of Electronic Materials Technology, ul. Wolczynska 133, 01-919 Warszawa
Tel. +48-22-8353041 ext.457, Fax: 48 39 12 07 64, e-mail: maljakub@itme.edu.pl
So please note this event in your calendar. You are cordially welcome.
Chairman of the Organizing Committee
Magorzata Jakubowska
Hungary
Meetings Programme:
The IMAPS-Hungary 2002 year activity will focus on the promotion of the following international conferences:
- 5th International Academic Conference on Electronic Packaging Education and Training, March 20-21, Dresden Hilton Hotel, Germany
- 25th International Spring Seminar on Electronics Technology, May 11 – 14, Prague, Czech Republic
- IMAPS-EUROPE CRACOW 2002, June 16–18, Cracow, Poland
- Polytronic 2002, June 23-26, Zalaegerszeg, Hungary
- SIITME 2002, Sep 19-22, Cluj-Napoca, Romania
- The Hungary Chapter will also be represented at IMAPS 2002, the 35th International Symposium On Microelectronics, September 4-6, Colorado Convention Center, Denver, CO
News from the Chapter:
The IMAPS Hungary Chapter held General Assembly Meeting at IBM Storage Products in Szekesfehervar on Dec 10. 2001. At the Meeting we accepted the report on the 2001 year activity and the activity plan for 2002. The nomination for the Chapter leaders was also accepted at the Meeting, and, in the meantime, by ballot voting the Chapter came to the result for years 2002 & 2003, as follows:
- President: Dr. Pal Nemeth, Budapest University of Technology and Economics, Department of Electronics Technology (BME-ETT) (nemeth@ett.bme.hu)
- President Elect: Dr. Gabor Papp, IBM Storage Products Hungary Ltd. (gpapp@hu.ibm.com)
- Vice President of Technical Programs: Dr. Balazs Kovacs, Solectron Hungary Ltd. (balazs kovacs@solectron.com)
- Vice President of Publications: Imre Goblos, HITELAP Inc. (hitelap@strarkingnet.hu)
- Secretary: Peter Gordon, PhD Scholar, BME-ETT (gordon@ett. bme.hu)
- Treasurer: Dr. Vera Kolonits, Microelectronics Foundation (kolonits.szk@chem.bme.hu)
- Past President: Dr. Zsolt Illyefalvi-Vitez, BME-ETT (illye@ett. bme.hu)
The official mailing address:
IMAPS Hungary Chapter, c/o Budapest University of Technology and Economics, Department of Electronics Technology (Zsolt Illyefalvi-Vitez), Goldman t. 3., Budapest, Hungary, H-1111
Phone: +36-1-463-2740
Fax:: +36-1-463-4118
E-mail: illye@ett.bme.hu
The Chapter will promote the activity of the NETPACK “Network of excellence in microelectronic system integration technologies - packaging” EC sponsored project. (You can get more information at the site www.netpack-europe.org).
The Chapter plans to have to club-days, one at the Elcoteq Hungary Ltd. Site in Pecs, and the other at the Bosch Magyarorszag Ltd. site in Hatvan.
Israel:
Meetings Programme:
- IMAPS - Israel bi- annual International Symposium, June 13
The IMAPS - Israel management team has decided that the IMAPS-Israel bi- annual International Symposium will be held in the Daniel hotel located in Herzeliya On Sea on the date of June 13.
This date has been decided based on the scheduling reasoning used successfully for the previous two symposiums in years 1998 and 2000 - to hold the symposium basically during the week before the European Annual Symposium and thus most or all foreign visitors - especially overseas presenters who can combine these two events within practically one week of travel abroad.
Russia:
News from the Chapter:
A new web site will be launched in February at www.imaps.ru; it will be a bilingual English/Russian site with updates etc.
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