On the cover: The International Conference on Advanced Packaging and Systems, Reno, Nevada, March 10-13, 2002, features technologies such as this Laser Direct-Write Technology showing a stepped fan out with 60-µm inner pitch and 250-µm outer pitch..

• Guest Editorial
  Timothy Lenihan, TGL Consulting

• Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder
  Zhenwei Hou, Guoyun Tian, Casey Hatcher & R. Wayne Johnson, Center for Advanced Vehicle Electronics, Auburn University, Erin Yaeger, Mark Konarski & LKarry Crane, Loctite Corp.

• Laser Direct-Write Technology and Its Low Processing Temperature Low Cost Applications
  David Liu, Scott Matthews, Chenping Zahng, Michael Duignan, Potomac Photonics, Inc.

• International Conference on Advanced Packaging Systems Program
  

• E-Mailing Your News to Editors? Do It Right!
  Mike Martel, MMC, Inc.

• In Memoriam - Harold Bell
  

• Advanced Technology Workshop on Ceramic Applications for Microwave and Photonic Packaging Program
  

• IMAPS '02
  From the General Chair

• IMAPS '02
  Destination Denver

• European Activities and Calendar of Events
  

• Photoimageable Thick-Films in Microwaves

• Cracow Registration Form