International
Technology

On the cover: IMAPS Europe 2002, the European Microelectronics Packaging and Interconnection Symposium with Table Top Exhibition, convenes in Cracow, Poland, June 16-18, 2002.

• Guest Editorial
  Søren Nøerlyng, MICRONSULT

• Lead-Free Soldering Causes Reliability Risks for Systems with Harsh Environments
  Hans Danielsson, MIKROELEKTRONIK KONSULT AB, Kumla, Sweden

• Chip in Polymer - the Next Step in Miniaturization
  A. Ostmann, A. Neumann, Technical University of Berlin; E. Jung, L. Boettcher and H. Reichl, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany

• The European Union Directive on the Restriction of Hazardous Substances (RoHS) - Alternative Materials
  P.D. Goodman, ERA Technology Ltd., Surrey, United Kingdom

• IMAPS 2002 Europe Program
  

• European Activities & Calendar of Events
  

• IMAPS 2002:
  From the General Chair
  Marketing Forum
  From the Technical Chair
  From the Exhibits Chair
  From the PDC Chair
  From the Student Chair
  

• Books Reviewed by Jerry E. Sergent, Ph.D.
  Environmentally-friendly Electronics: Lead-Free Technology, by Jennie S. Hwang

Hermeticity of Electronic Packages, by Hal Greenhouse

• IATW Report:
  Printing An Intelligent Future - Lake Tahoe, Nevada