Arizona Chapter Meeting on MEMS Packaging Overview and Activities at Amkor
IMAPS Chapter Meeting (Americas)
Tabletop exhibits available. MEMS Packaging Overview and Activities at Amkor, presented by Bob Kuo, Director of Advanced Package Development, Amkor.
Mesa City Library, 2425 S. Dobson Rd
Mesa, AZ
www.imaps.org/chapters/freepass.asp

IMAPS Nordic 2008
IMAPS Chapter Conference/Workshop (Europe)
IMAPS Nordic Annual Conference and Exhibition
Hotel Marienlyst,
Helsingoer, Denmark
www.nordic.imaps.org/past.asp

ATW on RF and Microwave Packaging
IMAPS Workshop
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technol
The Crowne Plaza , 2270 Hotel Circle North
San Diego, CA
www.imaps.org/rf

XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference
IMAPS Chapter Conference/Workshop (Europe)
For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.
The Polonia House in Pultusk - The Castle,
Pultusk, Poland
imaps2008.imio.pw.edu.pl

IMAPS Booth at IPC-Midwest
IMAPS Chapter Meeting (Americas)
IPC-Midwest is a regional technical conference to build a knowledge base, network with peers, and stimulate ideas. Industry professionals will present on lead-free technologies, design, PCB fabrication, supply chain and business issues, and assembly…
Renaissance Schaumburg Hotel & Convention Center , 1551 Thoreau Drive
Schaumburg, IL USA
www.ipcmidwestshow.org

Pittsburgh Technical Meeting at the Penn State Electro-Optics Center
IMAPS Chapter Meeting (Americas)
3 technical presentations, lab tour and dinner. Perspective on Photonic Packaging by John Mazurowski, PSU.
The Penn State Electro-Optics Center, Freeport, PA
Freeport, PA
www.imaps.org/programs/pittsburgh08sep.htm

Chesapeake-area Technical Meeting on Packaging Challenges in Defense Applications
IMAPS Chapter Meeting (Americas)
Presentations, dinner and tour. SOI in High G Environments (Michael Deeds, Navy Research Labs), and Power and Thermal Challenges for Advanced Army Land Systems (Bruce Geil, Army Research Labs).
Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park
College Park, MD
www.imaps.org/programs/chesapeake08sep.htm

Central Texas Chapter's Expo & Technical Program
IMAPS Chapter Meeting (Americas)
Attendee registration is FREE! Plan now to join us for free technical sessions, free lunch, and the chance to network with leading suppliers to our industry!
Univ. of Texas, J.J. Pickle Research Campus , 10100 Burnet Road, Building 137
Austin, TX
www.imaps.org/chapters/centraltexas/

Advanced Technology Workshop on Thermal Management
IMAPS Workshop
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems.
The Cabaña Hotel & Resort (A Crowne Plaza Resort) ,
Palo Alto, California - USA
www.imaps.org/thermal

7th International Symposium on Microelectronics and Packaging (ISMP 2008)
IMAPS Chapter Conference/Workshop (Asia)
The topics of the year will be in the area of the followings: Automotive Electronics, Telematics, MEMS, Power; 3-D, Embedded Substrate; Cu/Low k, Wafer Level; and LED, Solar cell.
The Korea Science and Technology Center(KSTC), 635-4, Yeoksam-Dong, Kangnam-gu
Seoul, Korea
www.imapsk.or.kr