The Electronics Group of Crane Aerospace & Electronics designs and manufactures high-density, high-reliability electronics for aerospace, space, military, medical, industrial and commercial applications. Product and service offerings are organized in solution sets, and include Power Solutions, Microwave Systems Solutions and Microelectronics Solutions.

Our Microelectronics Solutions miniaturizes electronics to reduce weight and size with increased reliability. We provide advanced miniaturization and packaging services from the beginning of the product development cycle into full volume production and beyond.  Our solution features capabilities such as surface mount, chip & wire, die stacking, chip scale packaging (CSP) and gold stud bumping. 

At Crane, our products are manufactured under the brand names Interpoint, ELDEC, and Signal Technology.  For more information on Crane Aerospace and Electronics, visit www.craneae.com and for Crane Co., visit www.craneco.com. 

Tessera Technologies, Inc., invests in, licenses and delivers innovative miniaturization technologies that transform next-generation electronic devices. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology.

In the early 1990s, Tessera’s founders invented fundamental packaging technology which is now widely used throughout the semiconductor industry. The company’s innovations include its visionary μBGA® solution, the ground-breaking chip-scale packaging CSP technology, which incorporates the Tessera Compliant Chip (TCC) technology. The µBGA CSP family enables a very short electrical path between the die and the module or printed circuit board (PCB), which allows the package to deliver performance that meets the requirements of memory such as high-performance DRAM.

Tessera continues to innovate and expand upon these technologies. The company’s µPILR™ solution is an advanced packaging solution designed to overcome technical limitations of interconnect, packaging and substrate technologies such as pitch, profile, performance, reliability and test capacity. Tessera’s extensive research and development efforts focus on electronic product miniaturization from a system perspective, specifically through the dense interconnection of components and extensive use of three-dimensional and advanced substrate packaging technologies.

For more information, visit www.tessera.com.

Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, display, photovoltaic, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow’s power to invent.

Dow’s portfolio includes: CMP, lithography, metallization and ceramic materials for semiconductor applications; surface preparation, metallization and imaging materials for interconnect, electronic and industrial finishing, and photovoltaic applications; precursor materials for LED, solar and semiconductor manufacturing; and zinc-based materials for optics.

For advanced semiconductor packaging, Dow Electronic Materials provides innovative materials that enable the latest schemes in production and in development, including wafer level chip scale packaging (WLCSP), flip chip, multi-functional system-in packages (SiP), and 3D chip packages. Product offerings include lithography materials for semiconductor packaging, including spin-on photodielectrics, photoresists and associated ancillaries, and a broad set of metallization products. These materials have a wide range of uses in packaging applications, such as copper pillar, through-silicon via (TSV), wafer bumping, trench and via filling, redistribution and under-bump metallization (UBM). Environmentally-friendly, lead-free options are available.

Dow Electronic Materials
455 Forest Street | Marlborough, MA 01752 | Tel: 508-481-7950 | Fax: 508-485-9113
Email: PFTInfo@rohmhaas.com | Web: www.rohmhaas.com

Established in 1984, STS is a leading manufacturer of cassette-to-cassette cluster and single/batch loadlocked plasma etch and deposition systems that can be configured with ICP, XeF2 and PECVD sources.

STS products include the market-leading ASE® deep silicon etch process (also known as Deep Reactive Ion Etch or DRIE) for dry, anisotropic, high aspect ratio etching.  This process has been used for over 10 years in MEMS manufacturing and is now a key enabling technology for etching through silicon via (TSV) interconnects for emerging 3D-IC applications.

STS' process technologies are available on a range of platforms which give a logical upgrade path from R&D and pilot production to volume production, without the need for process re-qualification.

STS and their parent company Sumitomo Precision Products Co., Ltd (SPP) operate two manufacturing sites in the UK and Japan, and have Regional Sales/Service Offices in California, Singapore and Taiwan supported by an established network of experienced local agents throughout Europe, USA and Asia.

For more details, see http://www.stsystems.com