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Journal
of Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)
Editor-in-Chief:
Fred D. Barlow III, Ph.D.
University of Idaho
jmep@imaps.org
Information For Authors
The Journal of
Microelectronics and Electronic Packaging is published
quarterly. Authors must submit manuscripts
of original technical content to the Journal's Editor-in-Chief
in an electronic format, preferably Microsoft Word. The
Journal publishes original manuscripts relating to the
theory,
design,
and performance of microelectronics and electronic
packaging. The Editor will consider papers that are consistent
with the technical focus of the Society -- "Everything in
electronics
between
the
chip
and
the system" which addresses the 4-Tier technical model: Microelectronics
Devices and Back-end Wafer Fab; 1st Level Packaging (Single
and Multi-chip); 2nd Level Packaging (Board Level); and System
Level Packaging (Box or Product Level). Tutorial and review
papers on these subjects are also published. Periodically,
special
issues
will present
collections
of technical
papers addressing important emerging technologies.
Regular Papers
The limit on the number of pages that a paper can
have in the Journal is a function of the paper subject, content,
etc. The actual maximum page-count is at the discretion of the
Editor-in-Chief and is something that we work out in conjunction
with the author(s) and the Editorial Board. Typically, papers
are twenty to twenty-five pages long.
To estimate the length of a manuscript, assume about 850 to 900
words per published page. Each figure or table will generally
occupy one fourth to one third of a page. The abstract is limited
to 250 words.
For the peer-review process,
the Editorial Board, consisting of world-wide experts working in related
fields, will evaluate the technical content of the manuscripts.
Other Submissions: correspondence, abstracts, special articles,
industry news, etc.
Other technical contributions of 2,000
words or less will also be published in the Journal pending
approval by the Editorial
Board. Contributions may be composed of not less than two
columns of text including figures.
Procedure for Submission:
Provide only original
research, development, engineering and manufacturing manuscripts,
short
notes, and comprehensive state
of the art reviews.
Papers not submitted to, accepted for, or fully published
elsewhere will be considered for publication. Manuscripts
must be submitted electronically as Microsoft Word files
and should be submitted via email to Brian Schieman, IMAPS, bschieman@imaps.org. A
web-based document management system will be available in
the future!
Technical Paper
Manuscript Guidelines:
All papers must be submitted as Microsoft
Word 2000 or later files. Papers do not need to be formatted for publication. Files can be submitted in "raw" form with no restrictions on column count, font style/sizes or placement of images. Images, graphs and/ or tables may be embedded in the article, inserted at the bottom of paper, or enclosed in a separate file . Once manuscripts are accepted following the peer-review process, our composition team formats the files as needed for publication.
Manuscripts
must be submitted electronically as Microsoft Word files
and should be submitted via email to Brian Schieman, IMAPS, bschieman@imaps.org. A web-based document management system will be available in
the future!
Accepted, revised papers should be resubmitted
with the following:
1. Revised submissions
should satisfy all of the requirements of an initial submission,
as detailed above.
2. A copyright release form must accompany the manuscript. A paper
must be approved and cleared for release by the company/institution/foundation
prior to its submission to the Journal.
AGREEMENT FOR TRANSFER OF COPYRIGHT
Author's submitting
papers for review and publication must complete this form and
send it with the manuscript. If the
submitted paper
has been prepared as a "work for hire" for an employer,
this form must be signed by the employer.
Download Transfer of
Copyright Form
(PDF File)
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