IMAPS - Journal of Microelectronics and Electronic Packaging

Journal of Microelectronics and Electronic Packaging
(ISSN # 1551-4897)

Editor-in-Chief:
Fred D. Barlow III, Ph.D.
University of Idaho
jmep@imaps.org

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This archival Journal is a publication of the International Microelectronics And Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in microelectronics, multichip module technologies, electronic packaging, electronic materials, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.

The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics And Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher. IMAPS members receive complimentary access to the On-line Journal with their membership.

In addition, members and non-members alike can also opt to subscribe to a printed copy and/or a CD-Rom version of JMEP, for an additional annual fee as structured below:

Member Subscription: 4 Printed Editions -- $35
Member Subscription: 4 CD-ROM Editions -- $25
Non-member/Library Subscription: 4 Printed Editions -- $100
Non-member/Library Subscription: 4 Printed and 4 CD-ROM Editions -- $150

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