IMAPS EVENTS
Thermal Management Workshop Hotel and Registration Deadlines in Two Days - August 24 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Arizona Chapter Lunch Meeting This Thursday on The Role of Intermetallic Compound Formation on Package Reliability (read more...)

Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits (read more...)

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007  (read more...)

News From IMAPS New England Chapter (read more...)

MicroTech 2008 Call for Papers (read more...)

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium (read more...)

   PRODUCTS AND PUBLICATIONS
The Journal of Microelectronics and Electronic Packaging 2nd Quarter 2007 Edition is Available On-line (read more...)

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited (read more...)

Thermal Management Workshop Hotel and Registration Deadlines in Two Days - August 24    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/thermal. The hotel cut-off and early registration deadline are August 24, 2007.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Sessions will address the following topical areas: Market Drivers, Pumped Liquid Cooling, System Cooling, Air Cooling, Thermal Interface Materials,
Datacenter Cooling, Test and Equipment, High Conductivity Materials and Passive Phase-Change.

View the complete Advance Program and register on-line at www.imaps.org/thermal.

Arizona Chapter Lunch Meeting This Thursday on The Role of Intermetallic Compound Formation on Package Reliability   ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: The Role of Intermetallic Compound Formation on Package Reliability. Lead free solders including SAC and AuSn will be presented by Jonathan Harris, PhD, President of CMC Interconnect Technologies.

RSVP by email - greg.clemons@intel.com.

Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits   ^ Top

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Nanotechnology
by Dr. Martin Moskovits
Chief Technology Officer API Nanotronics

Prior to joining API Nanotronics Dr. Moskovits was the Dean of Science and Professor of Physical Chemistry at the University of California, Santa Barbara. He also has significant academic and industrial leadership and research experience. Dr. Moskovits¹ research expertise includes the area of nanoscience and nanotechnology with special emphasis on nanosensors and is also known for developing porous anodic aluminum oxide as a template platform for nanotechnology. He serves as Vice Chair of the U.S. Department of Energy Basic Energy Sciences Advisory Committee and was a member of the DOE advisory committee on the establishment of the DOE's five nanocenters.

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,  www.imapsfrance.org.

MicroTech 2008 Call for Papers   ^ Top
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK. Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.

The special topic of MicroTech 2008 is “Chip to System …  Interconnect & Packaging ”.  IMAPS UK are looking for visionary  technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.

This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs.  The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.

We are inviting Key technical papers covering:

1. Emerging Applications
2. Future Interconnections
3. Developing Technologies
4. System Integration
5. Advanced Substrates
6. Nano-Tech Integration

Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.

Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB. 
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582   
Email: office@imaps.org.uk

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium   ^ Top
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at http://www.imaps.org/chapters/indiana/ for more information.

The Journal of Microelectronics and Electronic Packaging 2nd Quarter 2007 Edition is Available On-line   ^ Top
The Second Quarter 2007 issue of the Journal of Microelectronics and Electronic Packaging is available on-line. Log-on to access the Journal.

The Journal of Microelectronics and Electronic Packaging is published quarterly and offered to all members electronically via the IMAPS Website. Print subscriptions are available for an addtional rate.

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited    ^ Top
IMAPS Printed Proceedings are available again this year, but only to those who pre-order before October 10, 2007. While all IMAPS 2007 Full Symposium Registrants receive one copy of the Proceedings CD-Rom with their registration, the Printed Books are only available at an additional cost. Your Printed Proceedings will only be reserved if you pre-order a copy from IMAPS on/before October 10. Supplies are limited to pre-orders only and copies will not be made available after the Symposium. Visit www.imaps40th.org and follow the links for registration or visit http://www.imaps.org/registration/pubs1.asp to reserve your copy today.