IMAPS Electronic Bulletin

EMPC 2007 - 16th European Microelectronics and Packaging Conference & Exhibition - Begins Next Week ^ Top
We warmly invite you to the 16th European Microelectronics and Packaging Conference and Exhibition: EMPC2007. EMPC2007 takes place in the high-tech city of Oulu, Finland, June 17 - 20.

The EMPC conference addresses "everything in electronics between the chip and the system” welcoming everyone working with or designing products that need to be small, compact, cost effective, reliable and still having complex functionality.

Please find more details at the conference website: www.empc2007.org. We look forward to meeting you all in Oulu.

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

Dinner Choices: 1) Roasted Chicken Vesuvio [Marinated in Olive Oil, Rosemary, Lemon & Thyme, 2) Vegetarian Entrée (PLEASE INDICATE CHOICE)

"Year 2057 - Don’t Miss it!"
ABSTRACT: We can predict the future. Even better, we can influence the future. Futurists are convinced that we can, and should, play a key role in selecting and forging the best possible future using science and technology that continue to advance beyond most predictions. But there is a caveat; technology is always the double-edged sword that cuts both ways, to deliver good and bad that are not always discernible. We’ll attempt to gaze ahead, spanning the next 50 years, with a global perspective. We can start with obvious methods, like data extrapolation and trend tracing, to predict possible and even likely future activities. But, we can also speculate about disruptive events and the profound affects they might bring upon us. Our topics will include large and small technologies, life styles, abodes, energy, transportation, war, security, crime, law, justice, biomedical breakthroughs, offspring modification, external birthing, family of one, longevity, the environment, the decline of nationalism, and much more. We’ll add a splash of science fiction to help open our minds to absurd possibilities. Forget about political correctness, too. In less than an hour, we’ll solve the energy crisis, use micro-bots and implants to stay healthy, travel in driverless vehicles, and run remote factories from “home” with advanced telecommuting and secure control. Technology will greatly reduce crime making theft nearly impossible except for a demented genius. War as we know it, will be obsolete because of mutually agreed upon implemented technologies and dispute resolution rendered by the world’s most powerful computer - Justice II. And what computing method will dominate in the post-silicon future of 2057; nanoelectronics, photonics, biosystems, or something else? Will we still have circuit boards and solder? Security will be extreme and effective, but at the loss of privacy. Right - forget privacy! Your unique personal ID will be your own DNA code. But critical problems will remain - mostly self-inflicted. So, join the expedition to the year 2057 – and don’t be left behind.

But BRING checks payable to “IMAPS New England” At-door registration is an additional $5.00. If you make a reservation and can’t make the meeting, please cancel by Monday, June 25th or the Chapter is billed for your meal.

8th International Conference on Electronics Packaging Technology (ICEPT 2007) - August 14th – 17th, 2007, Shanghai, China ^ Top
Since 1994, ICEPT has been held for seven times in Beijing, Shanghai and Shenzhen of China, respectively. Since 2005 ICEPT has been held once a year due to rapid development of electronics packaging. As the only international electronics packaging technology conference organized and supported by authoritative academic organizations and leading industries, each ICEPT has attracted hundreds of participants from colleges, research institutes, packaging testing manufacturers, packaging testing equipment factories, packaging materials factories including distinguished experts, scholars and enterprises. The conference highly focuses on semiconductor packaging design, semiconductor packaging manufacturing, semiconductor packaging testing, LED packaging, MEMS packaging, system packaging and assembly, etc. The conference, which is domestically the highest-level and the most large-scale event for electronics packaging and testing technology, has become an important communication platform for advanced packaging technology. The 8th ICEPT will be held from August 14th to August 17th of 2007 in Shanghai, which is the biggest base of microelectronics industry and financial hub. We sincerely invite your participation.

1. Conference Information
Time:
Training course:
1）Registration time for training course: In the afternoon of August 13th, 2007 (Monday)
2）Training course-attending time: August 14th, 2007 (Tuesday)

Conference:
1）Conference-attending registration: August 14th, 2007 (Tuesday)
2）Conference time: August 15th-17th, 2007 (Wednesday to Friday)

Venue
Sofitel Jin Jiang Oriental Hotel, 889 South Yang Gao Road, Pudong New Area, Shanghai, China

Advanced Packaging & System Packaging: BGA, CSP, flip chip, WLP, nano-packaging, Cu/low-K packaging, 3D packaging, SiP and other advanced packaging and integration technologies.
High Density Substrate & SMT: HDI, PCB, high performance multi-layer substrate, embedded substrate, micro via, microjoin, stencil print, reflow, and other novel assembly technologies that improve substrate density and performance.
Packaging Design & Modeling: novel designs for various packaging/assembly, modeling, simulation and characterization solutions for electrical, thermal, optical & mechanical properties, multi-function & multi-scale modeling, simulation, validation methods and software technologies.
Packaging Materials & Processes: interconnection and encapsulation materials including bonding wires, solder balls, solder pastes, conductive pastes, underfillings, plastic packaging materials, adhesives, thin-films, dielectric materials, substrate materials, frame materials, green electronic materials and other novel materials that enhance the packaging properties and reduce the cost，and various packaging and assembly processes.
Advanced Manufacturing Technology: photolithography, laser processing, novel packaging/assembly technologies, advanced methods/softwares for modeling and monitoring of process effectiveness and cost analysis, and related manufacturing equipments.
Emerging Technologies: sensors, actuators, MEMS, NEMS and MOEMS, optoelectronics & LED packaging, LCD, solid state lighting, passive and RF devices, power & HV devices, nanodevices based on nanowire, nanotubes and polymers, etc.
Quality & Reliability: Quality monitoring and evaluation for packaging/assembly, advanced methods/technologies/tools for rapid reliability data collection and analysis system, reliability modeling & prediction, reliability issues in emerging technologies, testing equipments for quality control and reliability.

Conference Sections
Symposium, short course, academic communication, exhibition of new product & technology

Who Should Attend
Attendees of this conference in the past have been engineers, research scientists, equipment and material vendors, representatives from various packaging companies of packaging technology for IC, MEMS, Optoelectronics, LEDs, LCD, Magnetic Head, Sensors and PCB packaging and assembly. Due to the booming growth of the electronic/optoelectronic and emerging MEMS packaging industry in mainland China (including more than 300 IC packaging companies and several hundred LED packaging companies), this conference will provide a perfect platform for the exchange of information, research and industry development, and recruitment of young engineers.

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007 ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organise the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organised in five sessions including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”.
This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors.

For registration or information:
Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73 Fax: 33-(0)1-39 02 71 93