IMAPS EVENTS
Abstracts Still Being Accepted for the Advanced Technology Workshop on Integrated/Embedded Passives (read more...)

Advanced Technology Workshop on Thermal Management - Call For Abstracts (read more...)

IMAPS to Present Technical Session at SEMICON West 2007 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Arizona Chapter Meeting This Thursday, May 24, Featuring Rajen Chanchani's Presentation on 3D Integration Technologies: An Overview (read more...)

French Chapter Announces the Postponement of the SIP-SOC Meeting (read more...)

Metro Chapter Dinner Meeting Next Thursday, May 31 (read more...)

IMAPS Capital Chapter Joint Meeting June 5 with SMTA (read more...)

Chicago/Milwaukee/SMTA Joint Chapter Meeting – Thursday, June 7th (read more...)

EMPC 2007 - 16th European Microelectronics and Packaging Conference & Exhibition (read more...)

New England Chapter Annual Business Meeting on Tuesday, June 26 (read more...)

8th International Conference on Electronics Packaging Technology (ICEPT 2007) - August 14th – 17th, 2007, Shanghai, China  (read more...)

   MEMBERSHIP
Society Awards 2007 Deadline Next Thursday, May 31 (read more...)

Abstracts Still Being Accepted for the Advanced Technology Workshop on Integrated/Embedded Passives    ^ Top
The ATW on Integrated/Embedded Passives is being held November 15-17, 2007, at the San Jose Convention Center/Fairmont Hotel. This workshop is co-located with and immediately following IMAPS 2007 - the 40th International Symposium on Microelectronics. Abstracts are still being considered but must be submitted immediately by visiting http://www.imaps.org/abstracts.htm. For more information on the workshop, visit www.imaps.org/passives.

Advanced Technology Workshop on Thermal Management - Call For Abstracts    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The call for abstracts is now available on-line at www.imaps.org/thermal. Abstracts must be submitted before June 25, 2007.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop (ATW) on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS ATWs that are held each year. The 2006 Workshop featured 41 presentations, five of which were competition-selected graduate student papers.

IMAPS to Present Technical Session at SEMICON West 2007    ^ Top
Steve Adamson of Asymtek and IMAPS President-Elect has been asked to Chair an IMAPS Technical Session at SEMICON West. The IMAPS Session will take place on July 18, 2007, from 3:00 – 5:00 in the afternoon and will feature the cutting edge technology that IMAPS delivers worldwide.  The IMAPS Session will take place in the Mosconi Center – West Hall.

“Semi and IMAPS are exploring ways in which the two organizations can work cooperatively. We have started this process by putting together a group of five well regarded experts in the field of microelectronics and electronic packaging for this special session at Semicon West in San Francisco. The abstracts we’ve received indicate that the IMAPS session at SEMICON West will be of the highest caliber”, Adamson said.

The following speakers have already committed papers to the IMAPS session:

Novel Method of BGA Coplanarity Reduction at the Ball Attach Process
Rick Lathrop, Heraeus;

Lithography-Grade Controlled Expansion Substrates for Wafer Level Packaging
Greg Rudd, SpectraMat

IC packaging technologies - What's New?  What's Next?
Joe Fjelstad, Siliconpipe

Title -- TBD
Michael Todd, Henkel.

This session at Semicon West will reflect the quality of papers that will be presented at the 40th IMAPS International Symposium on Microelectronics in San Jose, from November 11th – 15th. 

Please show your support for this select group of speakers and IMAPS by attending this special session at Semicon West.

Arizona Chapter Meeting This Thursday, May 24, Featuring Rajen Chanchani's Presentation on 3D Integration Technologies: An Overview    ^ Top
Rajen Chanchani of Sandia National Labs will be presenting 3D Integration Technologies: An Overview. The presentation will focus on three key technologies: the motivation, description, status, issues and examples of their applications and the enabling technologies required to process them:

1. On-chip 3D integration - a ‘bottom-up’ approach where active layers are built-up over an IC wafer
2. 3D stacking of ICs/wafers - a ‘top-down’ approach where ICs are fabricated independently and then stacked (‘wafer on wafer’ and ‘die on wafer’)
3. 3D Packaging - the ICs are packaged in 3D Date: Thursday, May 24, 2007

Date:	Thursday, May 24, 2007
Schedule:	Registration and Lunch at 11:30 – 12:00 Presentation at 12:00
Location:	Mesa City Library Dobson Ranch Branch 2425 S. Dobson Road Mesa, AZ 85202
Cost:	Luncheon and presentation - $10.00 Vendor display tables available for $15.00
Registration:	Pre-registration has closed. Contact Greg Clemons for more information - greg.clemons@intel.com.

French Chapter Announces the Postponement of the SIP-SOC Meeting    ^ Top
Due to circumstances out of the control of IMAPS France, the SIP-SOC meeting which was planned May 24 in Caen, will be postponed to a later date. The new date, probably in next October, will be disclosed as soon as possible.

For information: please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org or
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93.

Or visit the chapter web site,    www.imapsfrance.org

Metro Chapter Dinner Meeting Next Thursday, May 31    ^ Top

AlSiC Part II, An Exotic Material Makes a Comeback and Then Some

More info to follow

Dr. Dan White
President and CEO
Thermal Transfer Composites LLC

This will be our last meeting until September. Come out and show your support.

There are a limited number of vendor tables available for this meeting at a cost of $200.00. Please contact Steve Lehnert if you are interested.

EMPC2007 is the bi-annual IMAPS EUROPE conference, this time organized by IMAPS-NORDIC, the Nordic Chapter of IMAPS. EMPC2007 is co-sponsored by IEEE-CPMT Europe, SMTA and NOKIA.

The EMPC conference addresses "everything in electronics between the chip and the system” welcoming everyone working with or designing products that need to be small, compact, cost effective, reliable and still having complex functionality.

• More than 150 presentations on opto, nano, micro, MEMS, 3D packaging, SIP, embedded components, applications, medical, RF, thermal management, ceramics, laminates & flex, etc.
• EU, NAMIS, GBC special sessions
• 6 short courses
• A very focused busy exhibition

Please find more details at the conference website: www.empc2007.org. We look forward to meeting you all in Oulu.

New England Chapter Annual Business Meeting on Tuesday, June 26    ^ Top

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

Dinner Choices: 1) Roasted Chicken Vesuvio [Marinated in Olive Oil, Rosemary, Lemon & Thyme, 2) Vegetarian Entrée (PLEASE INDICATE CHOICE)

"Year 2057 - Don’t Miss it!"
ABSTRACT: We can predict the future. Even better, we can influence the future. Futurists are convinced that we can, and should, play a key role in selecting and forging the best possible future using science and technology that continue to advance beyond most predictions. But there is a caveat; technology is always the double-edged sword that cuts both ways, to deliver good and bad that are not always discernible. We’ll attempt to gaze ahead, spanning the next 50 years, with a global perspective. We can start with obvious methods, like data extrapolation and trend tracing, to predict possible and even likely future activities. But, we can also speculate about disruptive events and the profound affects they might bring upon us. Our topics will include large and small technologies, life styles, abodes, energy, transportation, war, security, crime, law, justice, biomedical breakthroughs, offspring modification, external birthing, family of one, longevity, the environment, the decline of nationalism, and much more. We’ll add a splash of science fiction to help open our minds to absurd possibilities. Forget about political correctness, too. In less than an hour, we’ll solve the energy crisis, use micro-bots and implants to stay healthy, travel in driverless vehicles, and run remote factories from “home” with advanced telecommuting and secure control. Technology will greatly reduce crime making theft nearly impossible except for a demented genius. War as we know it, will be obsolete because of mutually agreed upon implemented technologies and dispute resolution rendered by the world’s most powerful computer - Justice II. And what computing method will dominate in the post-silicon future of 2057; nanoelectronics, photonics, biosystems, or something else? Will we still have circuit boards and solder? Security will be extreme and effective, but at the loss of privacy. Right - forget privacy! Your unique personal ID will be your own DNA code. But critical problems will remain - mostly self-inflicted. So, join the expedition to the year 2057 – and don’t be left behind.

For more information, visit: www.imapsne.org/meeting.html or download the
Printable PDF Meeting Notice.

But BRING checks payable to “IMAPS New England” At-door registration is an additional $5.00. If you make a reservation and can’t make the meeting, please cancel by Monday, June 25th or the Chapter is billed for your meal.

8th International Conference on Electronics Packaging Technology (ICEPT 2007) - August 14th – 17th, 2007, Shanghai, China   ^ Top
Since 1994, ICEPT has been held for seven times in Beijing, Shanghai and Shenzhen of China, respectively. Since 2005 ICEPT has been held once a year due to rapid development of electronics packaging. As the only international electronics packaging technology conference organized and supported by authoritative academic organizations and leading industries, each ICEPT has attracted hundreds of participants from colleges, research institutes, packaging testing manufacturers, packaging testing equipment factories, packaging materials factories including distinguished experts, scholars and enterprises. The conference highly focuses on semiconductor packaging design, semiconductor packaging manufacturing, semiconductor packaging testing, LED packaging, MEMS packaging, system packaging and assembly, etc. The conference, which is domestically the highest-level and the most large-scale event for electronics packaging and testing technology, has become an important communication platform for advanced packaging technology. The 8th ICEPT will be held from August 14th to August 17th of 2007 in Shanghai, which is the biggest base of microelectronics industry and financial hub. We sincerely invite your participation.

1. Conference Information
Time:
Training course:
1）Registration time for training course: In the afternoon of August 13th, 2007 (Monday)
2）Training course-attending time: August 14th, 2007 (Tuesday)

Conference:   
1）Conference-attending registration: August 14th, 2007 (Tuesday)
2）Conference time: August 15th-17th, 2007 (Wednesday to Friday)

Venue
Sofitel Jin Jiang Oriental Hotel, 889 South Yang Gao Road, Pudong New Area, Shanghai, China

Conference Website  http://www.icept.org

Conference Scale   400-500 participants

Conference Content

Conference Sections
Symposium, short course, academic communication, exhibition of new product & technology

Who Should Attend
Attendees of this conference in the past have been engineers, research scientists, equipment and material vendors, representatives from various packaging companies of packaging technology for IC, MEMS, Optoelectronics, LEDs, LCD, Magnetic Head, Sensors and PCB packaging and assembly. Due to the booming growth of the electronic/optoelectronic and emerging MEMS packaging industry in mainland China (including more than 300 IC packaging companies and several hundred LED packaging companies), this conference will provide a perfect platform for the exchange of information, research and industry development, and recruitment of young engineers.

2. Submission of Your Papers
If you want to submit a paper to this conference, please first send an abstract (500-1000 words) to our e-mail box technical.chair@icept.org or icept2007@sjtu.edu.cn (before May 31, 2007). Reported works in the abstract should be original and have not been published in other media or journals. The abstract should contain a clear statement of the purpose of the experiment, experimental results (including data, charts and pictures), conclusions and important references. All of the abstracts should be written in English based on the electronic template we send to you. We only accept electronic submission, which should include a word file and a PDF file simultaneously. Please put your detailed address (electronic mailbox, postal address, telephone and fax numbers) in the submitted abstract. All of the papers accepted by the ICEPT 2007 will be published in an IEEE conference proceeding. Research articles will be accepted and published in “Journal of Shanghai Jiao Tong University (English Edition)”, which is a source journal of Engineering Index (Ei). Corresponding author will be charged for publication in the above journal. In addition, IEEE-CPMT will publish a special section for selected papers based on a peer review process. For more information, please go to our website of http://www.icept.org.

Society Awards 2007 Deadline Next Thursday, Until May 31    ^ Top
Every year IMAPS members are asked to point out the Society’s members who have done such notable work that they deserve the distinction of one of our awards to publicly acknowledge their accomplishments.  We have many deserving members, who have given their time, energy, and expertise to ensure our industry has a robust future; you can make sure they are recognized by nominating them for one of our prestigious awards – but it must start with YOU!  The opportunity is here to let that special member know that you value their dedication and that his/her hard work has not gone unnoticed.  The Society Award nominations are now open.

The 2007 Awards Nominating Committee is actively seeking nominations for these awards: the Daniel D. Hughes, Jr. Memorial Award; the William D. Ashman Achievement Award; the John A. Wagnon Technical Achievement Award; the Outstanding Educator Award; the Sidney J. Stein International Award; the Corporate Recognition Award; and the Fellow of the Society Award.  The Lifetime Achievement Award is also an individual award, but will be awarded only occasionally when a deserving individual is identified and nominated.

Visit http://www.imaps.org/awards/index.htm for details and to nominate that special member. Nominations will be accepted until May 31, 2007.