IMAPS
Home | Join/Renew | Industry
Guide | Edit
Member Record|
IMAPS EVENTS
CHAPTER
ACTIVITIES (events
listed in chronological order)
PRODUCTS
AND PUBLICATIONS |
||||||||||||||||||||||||||||||
| IMAPS Events (view full Web Calendar) | ||||||||||||||||||||||||||||||
You Have Two More Days -- Device Packaging Early Registration and Hotel Deadlines Now Thursday, February 14 ^
Top Registrations are coming in quickly for this popular conference. Our hotel block has sold out quickly in the past two years and we expect the room block to sell out again r this year. Log-on to the conference website today and reserve your room before they are all gone. Radisson Fort McDowell Resort $209/night For on-line reservations: www.radisson.com/ftmcdowellaz - promotional code - IMAPS1 Hotel availability and rates will not be guaranteed after February 14, 2008. Visit www.imaps.org/devicepackaging today to learn more about this conference and to register on-line. GBC Spring 2008 Conference Deadlines This Thursday ^
Top This Conference precedes and is being held in conjunction with Device Packaging 2008. The GBC Spring 2008 Conference will address:
Sunday March 16, 2008 Monday, March 17, 2008 8:00 AM -- Opening Remarks and Keynote Address: Keynote address by 9:30 AM – 12:00 noon -- Microelectronics Industry Overview: Jim Walker, Vice President Research, Gartner/Dataquest 10:15 AM - Break 10:30 AM 12:00 Noon - Lunch 1:00 PM – 2:30 PM -- Cost Driven Challenges: 1:00 PM 1:45 PM 2:30 PM - Break 2:45 PM – 5:00 PM -- Performance Driven Challenges: 2:45 PM 3:30 PM 4:15 PM 5:00 Closing Remarks and Adjourn 5:00 – 7:00 Device Packaging Welcome Reception (beverages and light appetizers) Visit www.imaps.org/programs/gbc08spring.htm today to learn more about this conference and to register on-line. Early registration ends on February 14, 2008, after which all registration fees will increase. The hotel deadline is also February 14. Our hotel block has sold out quickly in the past two years and we expect the room block to fill up again this year. Log-on to the conference website today and reserve your room before they are all gone. Radisson Fort McDowell Resort $209/night For on-line reservations: www.radisson.com/ftmcdowellaz - promotional code - IMAPS1 Hotel availability and rates will not be guaranteed after February 14, 2008. IMAPS 2008 Early-Bird Exhibitor Discount Ends This Friday, February 15 ^
Top The exhibit floor is already more than 60% sold and on the way to selling out. Reserve your booth before it's too late. Visit www.imaps2008.org for more information and to reserve your booth space before this Friday, February 15. For questions, contact Ann Bell at abell@imaps.org or 202-548-8717. IMAPS/ACerS 3rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) - Program and Registration Now On-line ^
Top This three day event will bring together experts from Asia, Europe, North and South America to present and discuss the latest advances in ceramic interconnect and ceramic microsystems technologies. Coming from more than 60 different organizations including universities as well as industrial R&D, the conference will provide a wide spectrum of interests reflected in 70 contributed papers in 16 sessions. Because of growing interest in the CICMT meeting, there will also be an expanded poster session. Finally, to provide an opportunity for those involved in development and manufacturing to meet suppliers who support the industry, space has been set aside for tabletop exhibits. To reserve space, visit www.cicmt.org or contact Jens Müller (jens.mueller@imaps.de: +49 3677 69 3381). How Is the Cost of Packaging Impacting Your Business? ^
Top
|
||||||||||||||||||||||||||||||
| Chapter Activities (events listed in chronological order) | ||||||||||||||||||||||||||||||
New England Chapter Dinner Meeting Next Tuesday, February 19, Featuring Presentation on Photovoltaic Cell Metallization and Assembly ^ Top
Abstract: The talk describes practical uses for new nanosilver inkjet and screen-print inks. These uses include the fabrication of silver collecting grids for PV cells and attaching silicon die to various substrates. These uses rely on the unique properties of nano materials. Nanosilver lines were printed on mono and polycrystalline Si substrates using either a Dimatix Material Inkjet Printer or manual screen printer, depending on the nanosilver ink choice. Lines widths ranged between 70 and 120 µm wide and between 1 and 3 µm thick. Large areas were also printed (15mm x 15mm) for die attach applications. Mike Marczi B.S./M.S. Ceramic Engineering - Rutgers University Mike is the Director of New Business Development for Cookson Electronics with over 25 years of industry experience in ceramics, catalysis, electronic materials, display technology, thermal processing, surface mount assembly and nano materials. He has held positions in manufacturing, sales, marketing and strategic development. Granted multiple patents and published papers in the various fields described above. In his current position, Mike is focused on developing commercial applications for materials based on nano particle science. Metro Chapter February 27 Dinner Meeting with presentation on An Evaluation of Various Cleaning Solutions Mark Graham Modular Devices ^ Top
An Evaluation of Various Cleaning Solutions Abstract: There are many different methods of cleaning used in the microelectronics industry. When flux is used in your manufacturing process you are faced with a different set of challenges. Residual flux contamination left in a unit will result in difficulties in all subsequent operations. Any contamination can result in a failed wire bond, a poor electrical connection or any number of other failure modes that will cause premature failure of the unit. This presentation will focus on utilizing a vapor degreaser and will compare the results of four different chemicals. Mark Graham is Director of Program Development at Modular Devices Inc. He has been in the electronics industry for 27 years. Prior to joining Modular Devices in 1996, he was employed at Lucas Aerospace as a Senior Project Engineer. Mark is responsible for overseeing all major programs at Modular and has recently been appointed to the Technology Review Board. It is in that capacity that he was asked to perform the cleaning solution experiments. Metro Chapter Announces its 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 ^ Top
Tentative Schedule: May 7, 2008 A full day presentation on Flip Chip and Chip on Board Technology presented by: Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University
Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch) May 8, 2008 We will be holding a ½ Day Symposium & Table Top Show We are presently looking for Technical Presentations in the following Areas: Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered. Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available) Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: slehnert@imaps.org. We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net. May 9, 2008 A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation. Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space. In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment. This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry. The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique. The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern? Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented. In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor. Who Should Attend? This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages. Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch) Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register Announcing SoCal 2008 - June 4 in Los Angeles, California ^
Top June 4, 2008
Technical Program – This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies. Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email adrian.black@ngc.com. Online Attendee Registration – Available Soon Further information – Contact: International Conference on Electronics Packaging (ICEP) 2008 ^
Top Sessions are being planned in the following topical areas: Registration Fee: Organizing Committee: Contact: Interconex 2008 (Paris) - Abstracts Due February 29 ^
Top Papers are being accepted in the following topical areas:
Abstract Submission: Contact:
|
||||||||||||||||||||||||||||||
| Products and Publications | ||||||||||||||||||||||||||||||
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! ^
Top iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:
Using iKNOW’s Advanced Search Engine, you can locate papers by:
Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore. |
||||||||||||||||||||||||||||||
You Have Two More Days -- Device Packaging Early Registration and Hotel Deadlines Now Thursday, February 14 (
Global Business Council Spring Conference 2008
March 16-17, 2008
Scottsdale/Fountain Hills, AZ
International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org
International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM
CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany
*Exhibitors contact abell@imaps.org
ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008
Baltimore, MD
*Exhibitors contact abell@imaps.org
ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008
Baltimore, MD
*Exhibitors contact abell@imaps.org
HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org
IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org
View the Electronic Bulletin Archives