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First Announcement and Call for Abstracts for the new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications ^
Top The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.
Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 21, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 23, 2009. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event. Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits. Abstracts will be Accepted Until June 13 for the New RF and Microwave Packaging Workshop ^
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This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit www.imaps.org/rf. The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. Abstracts are being requested in the following areas:
Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than June 13, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit www.imaps.org/rf. |
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| Chapter Activities (events listed in chronological order) | ||||||||||||||||||||||||||
SoCal 2008 Is Just 7 Days Away - On-line Registration Ends Friday ^
Top The Proud Bird
Tabletop Exhibits Available Technical Program This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies Sample of Topics: Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email adrian.black@ngc.com. Online booth registration (Closes Friday, May 30) - http://www.imaps.org/registration/socal2008.htm Online Complimentary Attendee Registration (Closes Friday, May 30) – http://www.imaps.org/chapters/freepass.asp Further information – Contact: On-line Registration Ends This Friday for the Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert ^
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Speaker: Michael R. Ehlert Barry Industries Inc. LTCC - Past Present and FutureThis will be a broad overview of LTCC from conception through its growth to the present. We will examine some of the key drivers for its conception, what makes it unique and possible future applications. LTCC Standards MovementThis will be an up to the minute status report on current work in developing a comprehensive set of standards for all branches of the LTCC supply chain including Fired Properties, Un-Fired Properties and Processing. IMAPS Initiatives Arizona Chapter Lunch Meeting June 5 on Supply Chain Collaboration – Key for Transition to Fine Pitch (0.3mm) CSPs - On-line Registration Ends Next Tuesday ^
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Supply Chain Collaboration – Key for Transition to Fine Pitch (0.3mm) CSPs
Speaker: Ahmer Syed Upstate New York Meeting June 10 Featuring Presentation on Ceramics In Clean Tech and Tour of Infotonics Technology Center ^ Top
Ceramics In Clean Tech This presentation will address the use of varying amounts of porosity, to modify membrane and catalysis coating characteristics in fuel cell, gas separation membrane, and insulation packaging applications. These applications differ in the amount of porosity used in the key separation membrane, the yittria-stablized zirconia electrolyte in the fuel cell, the ceramic support structure in gas separation member, and the near total porosity fiber structure of ceramic insulation. Presenter Bio: John Olenick About ENrG Inc.: About the Infotonics Technology Center (ITC): Register on-line by Friday, June 6 at: http://www.imaps.org/registration/ny2008.htm IMAPS UK's MicroTech 2008 Begins June 10 - A Few Spots Remain ^
Top There is still time to book for IMAPS-UK's MicroTech 2008. Many of you will be attending the ELC meeting the day before so why not stay on and join us for our 40th anniversary event. There is a special price for ELC members of £305 +vat (total of £358.38) and this includes overnight accommodation and all meals including the gala dinner as well as conference admission. Entertainment at the dinner will be by the internationally famous Mazaika - http://www.mazaika-music.com. In addition there are still one or two exhibition spaces available if you are interested please contact Sylvia Outteridge, phone +44 1522 575212 or e-mail imapsuk@aol.com. International Conference on Electronics Packaging (ICEP) 2008 ^
Top Sessions are being planned in the following topical areas:
Other subject matter relating to electronics packaging will also be considered Registration Fee: Speakers: 40,000 yen (Including Reception and Proceedings) Organizing Committee: General Chair: H. Asai (Toshiba) Contact: Interconex 2008 (Paris) ^
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For more information, contact: International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) ^ Top ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
TECHNICAL PROGRAM:
Sessions are being planned describing new development in the following themes:
Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies. High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.
Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software. Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc. Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.
Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies. Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.
Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis. IMPORTANT DATES
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
SUBMISSION OF ABSTRACT/PAPER
The abstract deadline has passed. If you have questions about submitting an abstract, please email: icept2008@fudan.edu.cn.
The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals. For more information, visit http://www.icept.org/newweb/cpage.asp. XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference - Abstract Deadline Extended Until this Friday, May 30 ^
Top This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science. We received many requests from potential authors for and extension of the deadline for abstracts for this event. Therefore we have decided to extend the deadline until this Friday, 30 May, 2008.
We hope that you and your colleagues can submit abstracts before this day.
Please use abstract template available at mentioned web page and submit abstract electronically using the following address:
The Conference topics will include:
The Conference presentations will be made in the form of:
All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl. If you have any question please do not hesitate to contact us. The address for correspondence: Ryszard Kisiel (responsible for Proceedings and Book of Abstracts) Elżbieta Zwierkowska (Secretary of Organizing Committee) Małgorzata Jakubowska Abstracts Due This Friday, May 30, for the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) ^
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We are really sure that your presentation will greatly help the Symposium be successful and your internationally recognized expertise in the field will provide all the Symposium participants valuable scientific and technical information on the related area. We would extend a hearty welcome to all speakers in advance for accepting our invitation. Abstracts are now being accepted. Download the abstract form at www.imaps.org/chapter/asia/korea/ISMP2008_Invite.pdf. Abstracts must be sent to IMAPS-Korea by May 30th, 2008. For more information, please contact imapsk@imapsk.or.kr or visit http://www.imapsk.or.kr. We would also like to ask you to introduce the Symposium to your colleagues. We remember that audience's response was really great to all the presentations of foreign speakers last year. We are sure that the Symposium will be more successful with help of world-wide experts including you. |
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| Products and Publications | ||||||||||||||||||||||||||
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! ^
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Using iKNOW’s Advanced Search Engine, you can locate papers by:
Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore. |
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First Announcement and Call for Abstracts for the new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications (
IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA
ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org
ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA
ATW on Thermal Management
October 14-16, 2008
Palo Alto, CA
IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org
ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL
*Exhibitors contact abell@imaps.org
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