IMAPS Global Business Council’s Spring 2008 Meeting
Answering Important Challenges to the Semiconductor Industry

Washington, D.C. - January 22, 2008 - The Global Business Council of the International Microelectronics And Packaging Society (IMAPS) is targeting important questions with its Spring 2008 Meeting theme, “Addressing Cost and Performance-Driven Semiconductor Packaging Challenges through the Supply Chain.”

The program will kick-off with a Keynote Address by Bill Bottoms, CEO, NanoNexus, the title of which is “The 10th Anniversary Edition of the International Technology Roadmap for Semiconductors.”

Session Chairs of the Meeting are Gary Nicholls, OEM Marketing Manager, Cookson Electronics and Lee Smith, Senior Director of Business Development, Amkor Technology, Inc.

Sessions will include a Microelectronics Industry Overview, a session on Cost Driven Challenges and one on Performance Driven Challenges. In a joint statement, Howard Imhof, GBC Co-Chair, Director of Sales and Marketing, Metalor USA, and Greg Caswell, GBC Co-Chair, Vice President of Sales and Marketing, D2M Technologies, said, “Nicholls and Smith have succeeded in bringing together the industry experts who will be addressing the cost needs in specific areas of assembly and packaging that will enable the growth of the industry, the applications where performance is the absolute driver and the opportunities in the supply chain that can meet these challenges.”

The Global Business Council’s Spring 2008 Meeting will be held March 17, 2008, at the Fort McDowell Resort, Scottsdale, AZ. Program details can be found at www.imaps.org/gbc.

# # #

About IMAPS
The International Microelectronics And Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers 69 chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia. Under its 4-tier technical model, IMAPS produces numerous publications, workshops, and international conferences and exhibitions that address everything in electronics between the chip and the system.