IMAPS - International Microelectronics And Packaging Society: Bringing together the entire microelectronics supply chain!


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6th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

March 9-11, 2010

Global Business Council (GBC)
Spring 2009 Conference
www.imaps.org/gbc

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

March 7-8, 2010

Registration Form

EARLY REGISTRATION CUT-OFF: FEBRUARY 19, 2010
HOTEL DEADLINE: FEBRUARY 4, 2010

Register for both events as full attendees
and receive an additional $100 off your registration fees

Conference and Technical Workshops
March 9-11, 2010
Exhibition and Technology Showcase
March 9-10, 2010
Professional Development Courses
March 8, 2010
GBC Spring Conference
March 7-8, 2010
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Corporate
Sponsor:

Corporate Sponsor - NEXX Systems


Student Paper Competition
Sponsor:

Student Paper Competition Sponsor - The Microelectronics Foundation


Media
Sponsor:
3D InCites - Media Sponsor

Wafer & Device Packaging and Interconnect - Media Sponsor

IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 | E-mail: imaps@imaps.org

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