Advanced
Technology Workshop and Tabletop Exhibition on
Thermal Management
The Cabaña Hotel & Resort (A Crowne Plaza Resort)
Palo Alto, California - USA
October 13 - 16, 2008
Call For Abstracts
Abstract Deadline Extended: August 22, 2008
General
Chair
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com
Tel: 978-499-4990
|
Program
Chair
Vadim Gektin
Sun Microsystems, Inc.
vadim.gektin@sun.com
Tel: 408-276-6580
|
Submit Abstract(s) | Download PDF | Student Competition
Speaker Information | Hotel Reservations
Tabletop Exhibition Information | Exhibiting Companies
Reserve Tabletop(s) (Sold Out)
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutionsto meet current and evolving requirements in computing and wireless/telco systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.
This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS ATWs that are held each year. The 2007 Workshop featured 35 presentations, eight of which were competition-selected graduate student papers. The hotel at 4290 El Camino Real in Palo Alto, CA, was renovated in 2007. Information will be available on transportation methods by train and/or bus from area airports.
Speakers are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. Speakers are required to pay a reduced registration fee.
ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:
- Market Drivers: Thermal challenges and drivers combined with market trends, market segment size, cost drivers, and performance and reliability requirements.
- Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, and wireless/telco components and systems. Standards for reliability and testing. Metallic, metal matrix and polymer matrix materials.
- High Conductivity Materials: Metallic, ceramic and other composite materials with thermal conductivity equal to or higher than aluminum or copper, as well as thermal expansion closer to that of silicon and ceramic.
- Device Packaging: Chip-level packaging, including System-On-Package, Multi-Chip Module and Multi-Package Module, thermal/interconnect concerns.
- Liquid and Phase-Change Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
- Refrigeration Cooling: Presentations on advances in alternative solutions as well as reliability, serviceability, and availability.
- System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
- Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration paths from air to liquid cooling.
- Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
- Telecommunications Systems: Component- and system-level thermal management solutions for high-performance telecommunications systems.
- Consumer Electronics: Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.
PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than August 22, 2008. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 12, 2008. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.
Abstracts must be submitted online at http://www.imaps.org/abstracts.htm.
Questions: contact Jackki Morris-Joyner with questions: jmorris@imaps.org or 305-382-8433. You may also contact the workshop chairs.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Speaker Dates/Information:
-
Abstract due: August 22, 2008
- Speaker Notification/Confirmation emailed: August 29, 2008
-
Extended Abstract or Presentation Material due: September 12, 2008
-
Powerpoint/Presentation file for CD-Rom due not later than: October 16, 2008
-
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A)
Hotel Information -- Cut off: Monday Sept. 15, 2008
The Cabana Hotel Palo Alto – A Crowne Plaza Resort
4290 El Camino Real
Palo Alto, CA 94306
Rate: Single/Double $190
Phone Reservations: (800) 593-5447, mention International Microelectronics and Packaging Society
Online Reservations – www.cppaloalto.crowneplaza.com Group Code – IMA
